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Abdolvand, Amin

Publications and source records attributed to Abdolvand, Amin.

Low secondary electron yield engineered surface for electron cloud mitigation

Secondary electron yield (SEY or δ) limits the performance of a number of devices. Particularly, in high-energy charged particle accelerators, the beam-induced electron multipacting is one of the main sources of electron cloud (e-cloud) build up on the beam path; in radio frequency wave guides, the electron multipacting limits their lifetime and causes power loss; and in detectors, the secondary electrons define the signal background and reduce the sensitivity. The best solution would be a material with a low SEY coating and for many applications δ < 1 would be sufficient. We report on an alternative surface preparation to the ones that are currently advocated. Three commonly used materials in accelerator vacuum chambers (stainless steel, copper, and aluminium) were laser processed to create a highly regular surface topography. It is shown that this treatment reduces the SEY of the copper, aluminium, and stainless steel from δ{sub max} of 1.90, 2.55, and 2.25 to 1.12, 1.45, and 1.12, respectively. The δ{sub max} further reduced to 0.76–0.78 for all three treated metals after bombardment with 500 eV electrons to a dose between 3.5 × 10{sup −3} and 2.0 × 10{sup −2} C·mm{sup −2}.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Surface plasmon resonance assisted rapid laser joining of glass

Rapid and strong joining of clear glass to glass containing randomly distributed embedded spherical silver nanoparticles upon nanosecond pulsed laser irradiation (∼40 ns and repetition rate of 100 kHz) at 532 nm is demonstrated. The embedded silver nanoparticles were ∼30–40 nm in diameter, contained in a thin surface layer of ∼10 μm. A joint strength of 12.5 MPa was achieved for a laser fluence of only ∼0.13 J/cm{sup 2} and scanning speed of 10 mm/s. The bonding mechanism is discussed in terms of absorption of the laser energy by nanoparticles and the transfer of the accumulated localised heat to the surrounding glass leading to the local melting and formation of a strong bond. The presented technique is scalable and overcomes a number of serious challenges for a widespread adoption of laser-assisted rapid joining of glass substrates, enabling applications in the manufacture of microelectronic devices, sensors, micro-fluidic, and medical devices.

77 NANOSCIENCE AND NANOTECHNOLOGY↗