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Adolf, Douglas Brian

Publications and source records attributed to Adolf, Douglas Brian.

7 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2015

Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted for by the glass transition temperature, T g , depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, T ref , by the same amount as the T g depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive T g depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.

36 MATERIALS SCIENCE↗
DOE OSTI2011

Dynamic heat capacity of the east model and of a bead-spring polymer model.

In this report we have presented a brief review of the glass transition and one means of characterizing glassy materials: linear and nonlinear thermodynamic oscillatory experiments to extract the dynamic heat capacity. We have applied these methods to the east model (a variation of the Ising model for glass forming systems) and a simple polymeric system via molecular dynamics simulation, and our results match what is seen in experiment. For the east model, since the dynamics are so simple, a mathematical model is developed that matches the simulated dynamics. For the polymeric system, since the system is a simulation, we can instantaneously 'quench' the system - removing all vibrational energy - to separate the vibrational dynamics from dynamics associated with particle rearrangements. This shows that the long-time glassy dynamics are due entirely to the particle rearrangements, i.e. basin jumping on the potential energy landscape. Finally, we present an extension of linear dynamic heat capacity to the nonlinear regime.

36 MATERIALS SCIENCE↗
DOE OSTI2011

Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analyses of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.

36 MATERIALS SCIENCE↗