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Allen, Greg

Publications and source records attributed to Allen, Greg.

Radiation Effects Characterization and System Architecture Options for the 7nm Snapdragon SA8155P Automotive Grade System on Chip (SoC)

The SA8155P SoC is a complex heterogeneous computational platform with CPUs, GPU, DSPs and NPU. The SA8155P is a 7 TOPS/7 Watts capable AI/ML platform and as such represents a game changing breakthrough in terms computational power for space applications. We characterize the TID and SEE effects of the Qualcomm SA8155P Automotive grade SoC. Individual sub-system testing as well as application specific full device testing was conducted. We also discuss the commercial and automotive recovery mechanisms that are available with the SA8155P SoC generation and how those can form the basis for resilient architecture options for use in future space missions

Allen, Greg

Observation of Single-Event Burnout During Inductive Switching

1A power MOSFET demonstrated destructive Single-Event Effect (SEE) during ion irradiation in a switching circuit. Further investigation showed that the inductive load causing a spike in the drain-to-source voltage (VDS) that exceeded the manufacturer’s rating for several nanoseconds was enough to allow SEB. These results indicate that SEB may occur in a very short window and flyback is critical for disciplined power supply design.

Menke, Rob

Non Volatile Flash Memory Radiation Tests

Commercial flash memory industry has experienced a fast growth in the recent years, because of their wide spread usage in cell phones, mp3 players and digital cameras. On the other hand, there has been increased interest in the use of high density commercial nonvolatile flash memories in space because of ever increasing data requirements and strict power requirements. Because of flash memories complex structure; they cannot be treated as just simple memories in regards to testing and analysis. It becomes quite challenging to determine how they will respond in radiation environments.

single event upset results

Assessing and mitigating radiation effects in Xilinx FPGAs

The main purpose of this guideline is to document the current understanding of the effort and tradeoffs involved in using SRAM-based FPGAs with maximum achievable upset tolerance. This guideline summarizes the different testing strategies to be considered when assessing the SEE tolerance of SRAM-based FPGAs. For critical applications, in-beam testing of flight designs is strongly recommended in order to verify that the upset mitigation is working as well as the designer intended. At present, there are four manufacturers (Actel, Xilinx, Atmel, and Aeroflex) offering six FPGA types to the military market (i.e., some military spec screening and testing are specified) and four device types to the aerospace application market, which indicates that the manufacturers have added radiation parameter specifications. There is also a Honeywell and BAE Systems device that has been under development for several years, but it does not appear to be available yet; inquiries to Honeywell’s military/aerospace marketing arm on this product have been unanswered.

Allen, Greg