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Ardanuc, S.

Publications and source records attributed to Ardanuc, S..

Demonstration of waferscale voltage amplifier and electrostatic quadrupole focusing array for compact linear accelerators

Compact linear accelerators, with beam energies in the kiloelectron volt to megaelectron volt range, have applications in medicine, neutron/X-ray generation, surface modifications, etc. The size, weight, and power of existing accelerators preclude them from mass availability in portable formats. This paper presents a specific implementation of an ion accelerator architecture based on planar wafers with accelerating and focusing sections. Our low cost approach allows the control of the final ion beam energy with potential applications, for example, for accelerator-based ion implantation. In this paper, we demonstrate two important waferscale modules required to build a linear particle accelerator; these include (1) on-wafer voltage amplification for beam acceleration using Inductor-Capacitor (LC) resonators and (2) waferscale electrostatic quadrupole arrays (ESQA) to refocus the ion beams during transport. On-board LC resonators were developed using Printed Circuit Board fabrication processes to implement an LC element resonant at ~ 16.6 MHz with a quality factor of 25. An energy gain of ~ 250 eV was observed using a two wafer acceleration unit with an argon ion beam with 6.5 keV initial energy. A 3 × 3 ESQA was fabricated on a glass wafer with metal electrodes formed by depositing copper metal around the beam apertures. The ESQA was used to focus and defocus an argon ion beam, demonstrating a field gradient of ~ 500 V over a gap of ~ 250 μm.

43 PARTICLE ACCELERATORS↗

Staging of RF-accelerating Units in a MEMS-based Ion Accelerator

Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3 × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.

43 PARTICLE ACCELERATORS↗

A compact linear accelerator based on a scalable microelectromechanical-system RF-structure

Here, a new approach for a compact radio-frequency (RF) accelerator structure is presented. The new accelerator architecture is based on the Multiple Electrostatic Quadrupole Array Linear Accelerator (MEQALAC) structure that was first developed in the 1980s. The MEQALAC utilized RF resonators producing the accelerating fields and providing for higher beam currents through parallel beamlets focused using arrays of electrostatic quadrupoles (ESQs). While the early work obtained ESQs with lateral dimensions on the order of a few centimeters, using a printed circuit board (PCB), we reduce the characteristic dimension to the millimeter regime, while massively scaling up the potential number of parallel beamlets. Using Microelectromechanical systems scalable fabrication approaches, we are working on further red ucing the characteristic dimension to the sub-millimeter regime. The technology is based on RF-acceleration components and ESQs implemented in the PCB or silicon wafers where each beamlet passes through beam apertures in the wafer. The complete accelerator is then assembled by stacking these wafers. This approach has the potential for fast and inexpensive batch fabrication of the components and flexibility in system design for application specific beam energies and currents. For prototyping the accelerator architecture, the components have been fabricated using the PCB. In this paper, we present proof of concept results of the principal components using the PCB: RF acceleration and ESQ focusing. Finally, ongoing developments on implementing components in silicon and scaling of the accelerator technology to high currents and beam energies are discussed.

43 PARTICLE ACCELERATORS↗