Baldwin, Larry J. | Search NASA

NASA NTRS1994

Easily Processable High-Temperature Polyimide

Polymerization without volatile gases leads to high-quality resins. N-CYCAP (amiNe substituted CYClophane Addition Polyimide) is thermoset polyimide developed containing 4-amino{2.2}paracyclophane as end cap. Current improvements in synthesis of end cap include increasing yield to 60 percent overall and decreasing manufacturing time by simplifying synthetic procedure. Enables large-scale production and increases viability of cyclophane end caps for polymers for high-temperature applications. In comparison with neat resin moldings and composite matrix resins made of PMR-II-50, those made of N-CYCAP polymers found to be processable with lower void content and higher thermo-oxidative stability.

Sutter, James K.↗

NASA NTRS1991

Addition Curing Thermosets Endcapped with 4-Amino (2.2) Paracyclophane

A new family of addition curing polyimides were prepared that contained 4-amino (2.2)-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-(2.2) cyclophane was accomplished increasing the yield to 60 percent and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 C. C-13 CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to form void free neat resin specimens. Tg's as high as 353 C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies suggest that these resins have a high onset of decomposition ranging from 549 to 567 C.

Waters, John F.↗