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Bergmann, Michael

Publications and source records attributed to Bergmann, Michael.

Milestone in predicting core plasma turbulence: successful multi-channel validation of the gyrokinetic code GENE

On the basis of several recent breakthroughs in fusion research, many activities have been launched around the world to develop fusion power plants on the fastest possible time scale. In this context, high-fidelity simulations of the plasma behavior on large supercomputers provide one of the main pathways to accelerating progress by guiding crucial design decisions. When it comes to determining the energy confinement time of a magnetic confinement fusion device, which is a key quantity of interest, gyrokinetic turbulence simulations are considered the approach of choice – but the question, whether they are really able to reliably predict the plasma behavior is still open. The present study addresses this important issue by means of careful comparisons between state-of-the-art gyrokinetic turbulence simulations with the GENE code and experimental observations in the ASDEX Upgrade tokamak for an unprecedented number of simultaneous plasma observables.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Ultra-thin ohmic contacts for p-type nitride light emitting devices

A flip-chip semiconductor based Light Emitting Device (LED) can include an n-type semiconductor substrate and an n-type GaN epi-layer on the substrate. A p-type GaN epi-layer can be on the n-type GaN epi-layer and a metal ohmic contact p-electrode can be on the p-type GaN epi-layer, where the metal ohmic contact p-electrode can have an average thickness less than about 25 .ANG.. A reflector can be on the metal ohmic contact p-electrode and a metal stack can be on the reflector. An n-electrode can be on the substrate opposite the n-type GaN epi-layer and a bonding pad can be on the n-electrode.

42 ENGINEERING↗

LED structure with enhanced mirror reflectivity

Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror. The barrier layer is smaller than the mirror such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact is provided on the active region. In a further embodiment, the barrier layer is smaller than the mirror such that the periphery of the mirror is at least 40% free of the barrier layer, and the second contact is below the first contact and accessible from the bottom of the chip.

42 ENGINEERING↗