Engineering topics

Bhanu Sood

Publications and source records attributed to Bhanu Sood.

15 records

NASA NTRS2022

Lithium-ion Battery Strain Gauge Monitoring and Depth of Discharge Estimation

Lithium-ion battery diagnostics and prognostics rely on measurements of electrical impedance, capacity, and voltage to infer the internal state of the battery. Mechanical changes to the cell structure represent an additional measure of the battery’s state because these changes are related to the overall battery health. As lithium-ion batteries are charged and discharged, lithium ions are inserted or removed from the anode and cathode, a process called intercalation and de-intercalation. As lithium ions intercalate and de-intercalate, they can cause changes to the lattice of the electrode particles, resulting in volumetric changes. These volumetric changes cause mechanical stresses and strains on the lithium-ion battery electrodes, and subsequently, the whole cell’s thickness varies as it is charged and discharged. This paper presents a study on the use of surface-mounted strain gauges for in-situ measurement of structural changes to lithium-ion batteries, along with a characterization of the unit-to-unit differences in strain response. A neural network modeling structure is then used to predict the battery’s depth of discharge under dynamic discharge conditions.

Lithium-ion batteries, depth of discharge, strain ↗

NASA NTRS2022

Assurance of Electronic Parts for Aerospace System Reliability: Past, Present, and Future

Over the last two to three decades, the balance of influence within the electronics industry has shifted decisively towards the consumer electronics and information technology products, away from the defense or aerospace markets. This shift towards the commercial markets has changed certain ground rules in the electronics industry. Reliance of the aerospace industry, in particular, on components from supply chains dedicated to other products, or cross-vertical product integration, creates a supply web and introduces significant risks that are not necessarily present for volume-driven electronic products. Many of the unique risks in the aerospace industry emanate from the key characteristics of this industry. Although selection and usage of commercial electronics in NASA flight hardware is possible at a comparable (and in many cases lower) level of risk to that of employing parts that are screened to military or NASA specifications, for a large majority of flight projects it is difficult to distinguish the difference in on-orbit performance or reliability for parts screened at any level, or commercial parts that have no additional screening performed by the government. This paper identifies several bases for establishing context and developing unique or alternative approaches for successful parts selection and application within NASA and across the commercial space community.

electronic parts↗

NASA NTRS2020

Testing

Testing is conducted to verify that the connectors will properly perform over time (reliability) per the application requirements. Testing by the manufacturer usually involves performance testing per the datasheet requirements. However, the customer may have applications that require performance under unique operational and environmental conditions. In general, electrical tests for connectors include dielectric withstanding voltage, low-signal-level contact resistance, insulation resistance, contact resistance, and standing wave ratio. Environmental tests include humidity, temperature, and contaminating conditions, as well as mechanical stress environments including vibration, mechanical shock, and durability cycling exposures.

Connectors, testing, Dielectric Withstanding Volta↗

NASA NTRSDate not supplied

An Overview of Printed Circuit Board Risks and Supplier Capability

This NESC Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗

NASA NTRSDate not supplied

Design and Assembly Process Implementation for Embedding Passive and Active Components Introduction to IPC-7092

"This presentation describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and be made from organic, inorganic (ceramic) or both types of material."

embedded circuitry↗

NASA NTRSDate not supplied

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗

NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗

NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

Flexible PCB↗

NASA NTRSDate not supplied

A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed Circuit Boards↗

NASA NTRSDate not supplied

Press-fit Connectors in Spaceflight Applications - Drivers and Challenges

Starting from the 1970s when press-fit technology was nascent and confined within the telecommunications industry, this technology has matured as its adoption has increased within high reliability applications such as medical devices and avionics. Press-fit connectors are strongly preferred in today’s designs because the smaller press-fit pins require smaller diameter holes which require smaller pads and allows more routing real-estate without taking exceptions to specs. The lack of solder for a press-fit connection makes the conductive path more predictable for high-speed digital design and impedance discontinuities can be minimized as the signal moves from the printed circuit board to the connector. Touch-up during manufacturing is also reduced and streamlines the assembly process. This presentation at the 2022 NEPP ETW will introduce the audience to press-fit connectors and its contact physics followed by a deeper dive into specific press-fit applications for space flight environments, including information on qualification, testing, and screening.

pressfit↗

NASA NTRSDate not supplied