Engineering topics
Publications and source records attributed to Bickler, D. B..
An exciting scientific component of the Pathfinder mission is the rover, which will act as a mini-field geologist by providing us with access to samples for chemical analyses and close-up images of the Martian surface, performing active experiments to modify the surface and study the results, and exploring the landing site area.
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Impurities detected nondestructively during processing. In proposed system, surface of growing amorphous-silicon film monitored by ellipsometer at wavelength or combination of wavelengths at which impurity or impurities of interest absorb light strongly.
Contamination and nonuniformity are reduced. Substrates serve as walls of deposition chamber in configuration for plasma deposition of amorphous silicon. New chamber intended for production of amorphous silicon solar cells. Design reduces requirements on chamber size and expected to increase product quality.
The following major processes involved in the production of crystalline-silicon solar cells were discussed: surface preparation, junction formation, metallization, and assembly. The status of each of these processes, and the sequence in which these processes are applied, were described as they were in 1975, as they were in 1985, and what they might be in the future.
The Jet Propulsion Laboratory (JPL) WEB Team activities were reported for activities which were directed toward identifying and attacking areas in the growth of dendritic web ribbon, to complement the program at Westinghouse Electric Corp.
A photovoltaic cell, such as a solar cell, is provided which has a higher output voltage than prior cells. The improved cell includes a substrate of doped silicon, a first layer of silicon disposed on the substrate and having opposite doping, and a second layer of silicon carbide disposed on the first layer. The silicon carbide preferably has the same type of doping as the first layer.
An overview of processing activities aimed at higher efficiencies and economical production were presented. Present focus is on low-cost process technology for higher-efficiency cells of up to 18% or higher. Process development concerns center on the use of less than optimum silicon sheet, the control of production yields, and making uniformly efficient large-area cells. High-efficiency cell factors that require process development are bulk material perfection, very shallow junction formation, front-surface passivation, and finely detailed metallization. Better bulk properties of the silicon sheet and the keeping of those qualities throughout large areas during cell processing are required so that minority carrier lifetimes are maintained and cell performance is not degraded by high doping levels. When very shallow junctions are formed, the process must be sensitive to metallizatin punch-through, series resisitance in the cell, and control of dopant leaching during surface passivation. There is a need to determine the sensitivity to processing by mathematical modeling and experimental activities.
An overview is given of seven process development activities which were presented at this session. Pulsed excimer laser processing of photovoltaic cells was presented. A different pulsed excimer laser annealing was described using a 50 w laser. Diffusion barrier research focused on lowering the chemical reactivity of amorphous thin film on silicon. In another effort adherent and conductive films were successfully achieved. Other efforts were aimed at achieving a simultaneous front and back junction. Microwave enhanced plasma deposition experiments were performed. An updated version of the Solar Array Manufacturing Industry Costing Standards (SAMICS) was presented, along with a life cycle cost analysis of high efficiency cells. The last presentation was on the evaluation of the ethyl vinyl acetate encapsulating system.
Metal grains to be sintered precoated with frit metal. Coated metal powders used to make ink-like electrode pastes for printing and sintering electrode-fabrication process. Grains of base metal coated with lowmelting-point--, lead or tin-- by electroless deposition.
The invention relates to coated metal powders and to dispersions of such powders in liquid vehicles forming screenable, sinterable pastes for use in forming electrodes on photovoltaic devices. The primary nickel or copper metal particles are provided with a carrier of lower melting sintering metals such as 1-20% by weight, of a non-oxidizing metal such as lead or tin. The powdered metal systems operate on the basis of fusing together by way of eutectic alloying. As the paste is heated during firing the organic binder is first vaporized. An eutectic of the base metal (copper) and coating (tin) forms at the intersections of the base metal grains. This eutectic dissolves the grains and as the temperature is raised above the eutectic temperature, more of the base metal is dissolved. While the temperature is held at the higher value, the much smaller amount of sintering metal disappears as the eutectic dissolves and diffuses into the base metal until the composition of the eutectic is so enriched with base metal that it no longer has the eutectic properties and it solidifies. In this high temperature solidification, the base metal grains became thoroughly alloyed together and will not separate at the eutectic temperature (a lower temperature than their solidification by diffusion).
Metallization is discussed. The influence of hydrogen on the firing of base-metal pastes in reducing atmospheres is reported. A method for optimization of metallization patterns is presented. A process sequence involving an AR coating and thick-film metallization system capable of penetrating the AR coating during firing is reported. Design and construction of the NMA implantation machine is reported. Implanted back-surface fields and NMA primary (front) junctions are discussed. The use of glass beads, a wave-soldering device, and ion milling is reported. Processing through the module fabrication and environmental testing of its design are reported. Metallization patterns by mathematical optimization are assessed.
Screenable thick film solar cell electrodes are made using the all-metal electrode system, which eliminates the commonly used glass frit and substitutes an oxide scavenger such as silver fluoride. The low temperature firing copper metal systems give good results on solar cells obtaining cell efficiencies of 13% AM1, and adhering sintered structures are demonstrated with nickel systems. The potential effect of copper upon cell performance at elevated temperatures over long periods of time is determined, and it is found that the formation of a copper-silicon eutectic at 550 C produces needle-like structures with broad bases on the silicon, extending into and occasionally through the metallization layer.
Large-scale production model combines most modern manufacturing techniques to produce silicon-solar-cell panels of low costs by 1982. Model proposes facility capable of operating around the clock with annual production capacity of 20 W of solar cell panels.
The casting of silicon blanks for solar cells directly without slicing is an exciting concept. An experiment was performed to investigate the feasibility of developing a machine that casts wafers directly. A Czochralski furnace was modified to accept a graphite ingot-simulating fixture. Silicon was melted in the middle of the ingot simulator in a boron nitride mold. Sample castings showed reasonable crystal size. Solar cells were made from the cast blanks. The performance is reported.
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The paper describes a 'test case' manufacturing process sequence for solar photovoltaic modules which will cost 50 cents/watt in 1986. The process, which starts with the purification of silicon grown into 75-mm-wide thin ribbons, is discussed, and the plant layout is depicted; each department is sized to produce 250 MW of modules/per year. The cost of this process sequence is compared to present technology at various companies showing considerable spread for each process; data are tabulated in a composite state-of-the-art cell processing cost summary for these processes.
The state of low cost solar array technology is discussed. The goal of achieving $500/kW by 1986 is also discussed.