Engineering topics
Publications and source records attributed to Billington, K. L..
Method for creating low-resistance groundpath from electronic equipment to aluminum supporting structure requires no drilling or other penetration of structure. Method does not require costly silver-filled adhesive used previously. Ground connection is light weight, requires few parts, and not subject to galvanic corrosion. Placed at any convenient location on structure so interference with adjacent parts avoided.
Current pulses lower resistance of silver-filled epoxies. Capacitive discharge reduces interfacial resistance between aluminum surfaces joined with silver-filled epoxy. Technique offers noninvasive solution to problem of attaching grounding brackets to aluminum honeycomb structures.
When proper procedures are followed, hand crimping tool makes reliable, low-cost thermocouple connections. Procedure reduces time and expense of splicing solid and stranded platinum thermocouple wires.