Engineering topics
Birur, Gaj
Publications and source records attributed to Birur, Gaj.
From Concept-to-flight: An Active Thermal Control System for Mars Science Laboratory Rover
No abstract available
JPL Advanced Thermal Control Technology Roadmap - 2012
NASA's new emphasis on human exploration program for missions beyond LEO requires development of innovative and revolutionary technologies. Thermal control requirements of future NASA science instruments and missions are very challenging and require advanced thermal control technologies. Limited resources requires organizations to cooperate and collaborate; government, industry, universities all need to work together for the successful development of these technologies.
Thermally Stabilized Transmit/Receive Modules
RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.
JPL Advanced Thermal Control Technology Roadmap - 2008
This slide presentation reviews the status of thermal control technology at JPL and NASA.It shows the active spacecraft that are in vairous positions in the solar syatem, and beyond the solar system and the future missions that are under development. It then describes the challenges that the past missions posed with the thermal control systems. The various solutions that were implemented duirng the decades prior to 1990 are outlined. A review of hte thermal challenges of the future misions is also included. The exploration plan for Mars is then reviewed. The thermal challenges of the Mars Rovers are then outlined. Also the challenges of systems that would be able to be used in to explore Venus, and Titan are described. The future space telescope missions will also need thermal control technological advances. Included is a review of the thermal requirements for manned missions to the Moon. Both Active and passive technologies that have been used and will be used are reviewed. Those that are described are Mechanically Pumped Fluid Loops (MPFL), Loop Heat Pipes, an M3 Passive Cooler, Heat Siwtch for Space and Mars surface applications, phase change material (PCM) technology, a Gas Gap Actuateor using ZrNiH(x), the Planck Sorption Cooler (PCS), vapor compression -- Hybrid two phase loops, advanced pumps for two phase cooling loops, and heat pumps that are lightweight and energy efficient.
Mechanically Pumped Fluid Loop (MPFL) Technologies for Thermal Control of Future Mars Rovers
Mechanically pumped fluid loop has been the basis of thermal control architecture for the last two Mars lander and rover missions and is the key part of the MSL thermal architecture. Several MPFL technologies are being developed for the MSL rover include long-life pumps, thermal control valves, mechanical fittings for use with CFC-11 at elevated temperatures of approx.100 C. Over three years of life tests and chemical compatibility tests on these MPFL components show that MPFL technology is mature for use on MSL. The advances in MPFL technologies for MSL Rover will benefit any future MPFL applications on NASA s Moon, Mars and Beyond Program.
A comparative analysis of loop heat pipe based thermal architectures for spacecraft thermal control
Loop Heat Pipes (LHP) have gained acceptance as a viable means of heat transport in many spacecraft in recent years. However, applications using LHP technology tend to only remove waste heat from a single component to an external radiator. Removing heat from multiple components has been done by using multiple LHPs. This paper discusses the development and implementation of a Loop Heat Pipe based thermal architecture for spacecraft. In this architecture, a Loop Heat Pipe with multiple evaporators and condensers is described in which heat load sharing and thermal control of multiple components can be achieved. A key element in using a LHP thermal architecture is defining the need for such an architecture early in the spacecraft design process. This paper describes an example in which a LHP based thermal architecture can be used and how such a system can have advantages in weight, cost and reliability over other kinds of distributed thermal control systems. The example used in this paper focuses on a Mars Rover Thermal Architecture. However, the principles described here are applicable to Earth orbiting spacecraft as well.
Advanced thermal control technology for space applications
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An Experimental Study of the Operating Temperature in a Loop Heat Pipe with Two Evaporators and Two Condensers
This paper presents a comprehensive experimental study of the loop operating temperature in a loop heat pipe (LHP) which has two parallel evaporators and two parallel condensers. In a single evaporator LHP, it is well known that the loop operating temperature is a function of the heat load, the sink temperature and the ambient temperature. The objective of the present study emphasizes on the stability of the loop operating temperature and parameters that affects the loop operation. Tests results show that the loop operating temperature is a function of the total system heat load, sink temperature, ambient temperature, and beat load distribution between the two evaporators. Under most conditions, only one compensation chamber (CC) contains two-phase fluid and controls the loop operating temperature, and the other CC is completely filled with liquid. Moreover, as the test condition changes, control of the loop operating temperature often shifted from one CC to another. In spite of complex interactions between various components, the test loop has demonstrated very robust operation even during fast transients.
Active Control of the Operating Temperature in a Loop Heat Pipe with Two Evaporators and Two Condensers
The operating temperature of a loop heat pipe (LHP) with multiple evaporators is a function of the total heat load, heat load distribution among evaporators, condenser temperature and ambient temperature. Because of the many variables involved, the operating temperature also showed more hystereses than an LHP with a single evaporator. Tight temperature control can be achieved by controlling its compensation chamber (CC) temperatures at the desired set point. This paper describes a test program on active control of the operating temperature in an LHP with two evaporators and two condensers. Temperature control was achieved by heating one or both CC's. Tests performed included start-up, power cycle, sink temperature cycle, CC temperature cycle, and capillary limit. Test results show that, regardless one or two CC's were heated to the set point temperature, one of CC's was always flooded with liquid. The loop could operate successfully at the desired set point temperature under most conditions, including some fast transients. At low heat loads, however, the CC temperature could suddenly increase above the set point temperature, possibly due to a sudden change of the vapor content inside the evaporator core.
Testing of a Loop Heat Pipe with Two Evaporators and Two Condensers
Most existing Loop Heat Pipes (LHPs) consist of one single evaporator and one single condenser. LHPs with multiple evaporators will be very desirable for cooling multiple heat sources or a heat source with large thermal footprints. Extending the LHP technology to include multiple evaporators and multiple condensers faces some challenges, including the interaction between individual compensation chambers, operating temperature stability, and adaptability to rapid power and sink temperature transients. This paper describe extensive testing of an LHP with two evaporators and two condensers. Tests performed include start-up, power cycle, sink temperature cycle, reservoir temperature cycle, and capillary limit. Test results showed that the loop could operate successfully under various heat load and sink conditions. The loop operating temperature is a function of the total heat load, the heat load distribution between the two evaporators, and temperatures of the two condenser sinks. Under most conditions, only one reservoir contained two-phase fluid and the other reservoir was completely liquid filled. Moreover, control of the loop operating temperature could shift from one reservoir to the other as the test condition changed.
Thermal and Mechanical Microspacecraft Technologies for X-2000 Future Deliveries
Thermal and mechanical technologies are an important part of the X-2000 Future Delivery (X-2000 FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by the X-2000 FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The X2000 FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. One of the key ideas used in the development of these technologies and architecture is that several functions be in included in each of the thermal and mechanical elements. One of the thermal architecture being explored for the X-2000 FD microspacecraft is integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to X-2000 FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper to be presented at the 1999 conference, will describe the progress made so far in the microspacecraft thermal and mechanical technologies and approaches for the X2000 Future Deliveries microspacecraft.
Loop Heat Pipe Applications for Thermal Control of Martian Landers/Rovers
In early nineties Mars was designated as the planet to be explored. The present results of Mars program include the following: Background of Mars program. Thermal control design for Martian spacecraft. Loop heat pipe for Lander and Rover. Test results. and LHP applications for future Martian Lander and Rover.