Qualifying a cleaning system for space flight printed wiring assemblies
This paper addresses a centrifugal cleaning system used in conjunction with a water-based cleaning medium to achieve optimally low levels of contaminants on PWAs.
Engineering topics
Publications and source records attributed to Bonner, K..
This paper addresses a centrifugal cleaning system used in conjunction with a water-based cleaning medium to achieve optimally low levels of contaminants on PWAs.
None given. From Background section: JPL, in partnership with an industrial consortium, is engaged in the investigation of reliability and quality issues of ball grid array (BGA) packages for space flight electronics applications.
For the past two years, JPL has been working to introduce surface mount technology (SMT) for high reliability space applications. The thrust has centered around four research and development projects, the aim of which is to facilitate the use of SMT for designing, producing, inspecting, and quantifying surface mount printed wiring assemblies for ultralow volume, long life space applications. This paper explores the current approach being pursued at JPL and some of the problems peculiar to applying SMT to spacecraft applications.
There is a need for high reliability surface mount assembly processes for aerospace, military, and medical applications. This approach for improving design for producibility and reliability of electronic system assembly processes can be utilized as a starting framework. Described herein is a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs.
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