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Bonner, Richard W.

Publications and source records attributed to Bonner, Richard W..

Thin hybrid capillary two-phase cooling system

A novel hybrid two-phase cooling system was developed that integrated a mechanically pumped two-phase loop with a capillary-driven two-phase cooling device. The latter cooling mechanism was based on evaporation/boiling from wick structures made by sintering copper particles on the interior surfaces of a copper cold plate. The cold plate provided cooling to two surfaces and each of them included four heaters in series. The novelty of the developed technology was preventing flooding of the evaporator wicks by isolating the evaporation surface from the pumped liquid flow that fed them. This arrangement allowed for a high liquid feed flow rate much greater than would be allowed by a capillary pumped system while maintaining a low thermal resistance at the evaporation surface. Using this approach, the cooling system removed over 850 W with a low pumping power below 1.0 W while using R245fa as the working fluid. The equivalent heat fluxes exceeded 970 W/cm 2 over areas less than 0.12 cm 2 . The measured thermal resistance was as low as 0.09 K-cm 2 /W. The presented thermal management solution enables an increase in the power of high heat flux electronic devices beyond the state-of-the-art.

42 ENGINEERING↗

Intermediate Temperature Fluids Life Tests - Experiments

There are a number of different applications that could use heat pipes or loop heat pipes (LHPs) in the intermediate temperature range of 450 to 725 K (170 to 450 C), including space nuclear power system radiators, fuel cells, and high temperature electronics cooling. Historically, water has been used in heat pipes at temperatures up to about 425 K (150 C). Recent life tests, updated below, demonstrate that titanium/water and Monel/water heat pipes can be used at temperatures up to 550 K (277 C), due to water's favorable transport properties. At temperatures above roughly 570 K (300 C), water is no longer a suitable fluid, due to high vapor pressure and low surface tension as the critical point is approached. At higher temperatures, another working fluid/envelope combination is required, either an organic or halide working fluid. An electromotive force method was used to predict the compatibility of halide working fluids with envelope materials. This procedure was used to reject aluminum and aluminum alloys as envelope materials, due to their high decomposition potential. Titanium and three corrosion resistant superalloys were chosen as envelope materials. Life tests were conducted with these envelopes and six different working fluids: AlBr3, GaCl3, SnCl4, TiCl4, TiBr4, and eutectic diphenyl/diphenyl oxide (Therminol VP-1/Dowtherm A). All of the life tests except for the GaCl3 are ongoing; the GaCl3 was incompatible. As the temperature approaches 725 K (450 C), cesium is a potential heat pipe working fluid. Life tests results are also presented for cesium/Monel 400 and cesium/70-30 copper/nickel heat pipes operating near 750 K (477 C). These materials are not suitable for long term operation, due to copper transport from the condenser to the evaporator.

Anderson, William G.↗