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Borden, T. J.

Publications and source records attributed to Borden, T. J..

Protective Cover for IC Packages

Aluminized plastic protects integrated circuits from static discharge. Snap-on cover shorts leads of integrated-circuit flatpack to prevent damage from electrostatic discharges during transport, installation, or other handling before final testing. Cover removed only during lead bending and testing.

Borden, T. J.

Wire-Wrap Chatter Detector

Monitoring circuit responds to changes in resistance as little as 0.1 ohm. Has been used to detect defective wire-wrap connections during thermal and vibration tests. Defect is indicated to operator by light-emitting diode and by increase in count on a two-digit display.

Fisch, G. Z.

Packaging techniques for low-altitude Venus balloons beacon

The results of a specific design project for the Venus balloon beacon, in which a microwave beacon is required to operate for a limited time at high temperature (350 C) and at high pressure, (10 bars). In a chemically hostile environment after surviving large mechanical shock forces (up to 280 gs) are discussed. It was found that many existing, commerically-available component can be used in such a design with only minor modifications. A further result is that a crude (and consequently low-cost) test program can be designed to identify and select promising commercial components.

Borden, T. J.