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Bosco, Nick (ORCID:0000000288732577)

Publications and source records attributed to Bosco, Nick (ORCID:0000000288732577).

Investigating the Crosslinking, Degradation, and Adhesion Behavior of Photovoltaic Encapsulants Under Thermal Accelerated Aging

Degradation of photovoltaic (PV) module encapsulant characteristics that lead to mechanical embrittlement and delamination remains a cause of failure in solar installations. A multiscale reliability model connecting the encapsulant mechanical and fracture properties to the degraded molecular structure and interfacial bonding to adjacent solar cell and glass substrates was previously published. The model, developed primarily for poly(ethylene-co-vinyl acetate) acetate (EVA) encapsulants, remains to be experimentally validated. Determining the degradation and crosslinking kinetics of alternative encapsulants, such as polyolefin elastomer (POE) and EVA/POE/EVA composites (EPE), can generalize the model. In this work, we subject fully cured EVA, POE, and EPE encapsulants to accelerated thermal aging to determine how high temperatures impact reaction kinetics. An increase in gel content (crosslinking) and decrease in crystallinity of the encapsulants under hot-aerobic (90 degrees C, 22% RH) and hot-anaerobic (90 degrees C, sealed in N 2 air) aging were observed, even in the absence of UV and crosslinking initiators. Fourier transform infrared spectroscopy (FTIR)-attenuated total reflectance analysis showed insignificant encapsulant degradation, demonstrating the critical role of UV and moisture in accelerating degradation. Adhesion testing performed on coupon-level specimens (cell/encapsulant/glass laminates) showed decreases in adhesion energy, Gc , from 5000 h of hot-dry (90 degrees C, ~1% RH) and hot-humid (90 degrees C, 60% RH) aging. POE coupons demonstrated the best stability, followed by EPE then EVA. For EVA and POE, hot-humid aged coupons experienced a larger decrease in Gc due to enhanced hydrolytic degradation. Hot-dry aging condition demonstrated that thermal degradation of the interface could be significant even if the encapsulant experiences negligible degradation in the absence of UV and elevated humidity.

accelerated aging↗

Cracked Gridline Wear Out Follows a Power Law

Cracks can form in Silicon solar cells in photovoltaic modules due to mechanical stresses arising from various extrinsic factors like handling and weather. While the immediate performance degradation may be minor, continuous loading overtime will degrade module performance. One probable reason is gridline surface wear across the cracked silicon with increased cyclic loading. In this work we propose a method to correlate gridline wear to module electrical degradation. We begin by conducting cyclic four-point bending tests on laminated silicon solar cells with a single crack and 22 intact gridlines for 10,000 cycles. We measure the progressive change in resistance during each loading cycle. We correlate it to a length scale called critical crack opening displacement (CCOD) that signifies failure of individual gridlines. By employing Weibull analysis, we determine the characteristic CCOD for all cycles and fit this data to a modified version of a wear power law. We observe that this i ts the data well. We also propose to study the effect of individual parameters in the power law equation and extend the equation to include material properties.

bending↗

Towards Polymer-Free, Femto-Second Laser-Welded Glass/Glass Solar Modules

This project explores the use of femto-second (fs) lasers to form glass-to-glass welds for hermetically sealed, polymer-free solar modules. Low iron solar glass coupons were welded together without the use of glass filler using a fs laser with dedicated optics to elongate the focal plane parallel to the incident beam. The resulting welds were then stress tested to failure to reveal the critical stress intensity factor, KIc. These values were used in a structural mechanics model of a 1 m by 2 m glass/glass module under a simulated static load test. The results show that the fs laser welds are strong enough for a suitably framed module to pass the IEC 61215 static load test with a load of 5400 Pa. Key to this finding is that the module must be framed and braced, and the glass must be ribbed to allow pockets for the cells and welds inside the border of the module. The result is a module design that is completely polymer-free, hermetically sealed, has improved thermal properties, and is easily recycled.

femto-second laser welded↗

Determining the Crosslinking and Degradation Reaction Kinetics in Photovoltaic Encapsulants Using Accelerated Aging: Preprint

Degradation of photovoltaic (PV) module encapsulant mechanical characteristics that lead to embrittlement and delamination remains a cause of failure in solar installations. A multiscale reliability model based on detailed molecular degradation reaction kinetics was previously published, connecting the encapsulant mechanical properties (elastic modulus, yield strength, and adhesion energy) to the degraded molecular structure and interfacial bond density to adjacent solar cell and glass substrates. The model, developed primarily for poly(ethylene-co-vinyl acetate) (EVA) encapsulants, remains to be experimentally validated. Determining the degradation and crosslinking kinetics of alternative encapsulants, such as polyolefin elastomer (POE) and EVA/POE/EVA composites (EPE), can further generalize the model. Importantly, the activation energy for crosslinking of fully cured PV encapsulant products from temperature or UV is presently unknown or unavailable. In this work, we subject EVA, POE, and EPE encapsulants to a set of accelerated aging conditions, varying the temperature, UV intensity, and relative humidity. We use DSC, FTIR, and Soxhlet extraction (gel content) to characterize the encapsulants' changing molecular structure. This allows for determination of the photochemical degradation and crosslinking kinetics of the encapsulants. Preliminary results show an increase in gel content (crosslinking) and a decrease in crystallinity of EVA, POE, and EPE encapsulants under hot-aerobic (90 deg C, 22% RH) and hot-anaerobic (90oC, sealed in N2 air) accelerated aging, even in the absence of UV and crosslinking initiating agents. For a least squares regression with an assumed first-order crosslinking kinetics, the crosslinking rate parameters were computed for the three encapsulants under hot-aerobic and hot-anaerobic aging conditions. FTIR analysis showed insignificant encapsulant degradation for hot-aerobic and hot-anaerobic aging, demonstrating the critical role of UV and moisture in accelerating degradation. Aging conditions with UV exposure and elevated humidity are presently in progress.

adhesion↗

Residual Stress Limits Gridline Bridging in Cracked Solar Cells

Cracks in solar cells can be generated in various ways, but this does not mean immediate power loss. Previous studies showed that gridlines bridge cracked silicon cells, and the bridging behavior decreases during the contact and separation of gridlines within bare cells. In this study, we investigate bridging behavior in laminated monocrystalline cells. We characterize the behavior with Weibull analysis of critical crack opening distance (COD), at which the gridline is completely separated. The Weibull analysis of the laminated cell shows a good agreement with bare cells at the first cycle. However, we observe different behavior during cyclic bending. Bare cells show gradual decay of critical COD, while laminated cells show instant decay and plateau. We hypothesize that the difference is due to residual stress, squeezing gridlines, and causing plastic deformation. This is justified by the correlation between critical COD and gridline morphology. In the presentation, we shall present a Weibull analysis of the cyclic bending of a laminated cell with a reduced residual stress effect.

bending↗

Laser-Welded Seals for Polymer-Free Glass/Glass Modules

This project explored the use of femtosecond laser welding to form strong, hermetic seals for glass/glass modules. The results showed that glass/glass fs laser welds, when coupled to a new module design, are strong enough to enable a polymer-free module, potentially extending warrantees and forming an easily-recycled product.

DuraMAT↗

Laser Welded Edge Seals for Polymer-Free Glass/Glass Modules

This presentation covers fs lasers which enable crack-free and stress-free glass/glass welds. Welds are nearly as strong as the glass (KI, weld ~ KI, glass) and static load test passed, enabling: 1) polymer-free; 2) hermetically sealed; and 3) recyclable modules. Next steps are: 1) follow-on funding; 2) develop feed throughs (metal/glass welds already achieved for other devices); and 3) weld mini modules for further IEC module testing.

DuraMAT↗

Characterization of Interconnects

Combined-accelerated stress testing (C-AST) simultaneously combines stress factors of the natural environment (including UV radiation, temperature, humidity, electrical current, and external mechanical force) into a single test that requires fewer modules, fewer chambers, and makes it possible to discover weaknesses in new designs that are not known a-priori. C-AST reduces risk, accelerates time to market, and improves bankability by reducing costly overdesign using test levels not exceeding those seen in the natural environment. This project seeks to evaluate strengths and weaknesses of modern cell interconnect designs with combined-accelerated stress testing (C-AST) to screen multiple climates along with finite element and failure analysis to determine the potential for a 50-year life. Supporting this, we seek to develop methods of characterization to assess the degradation of interconnects, enable predictive rate models with material forensics and FEA and show C-AST's ability to find interconnect failures and benchmark it relative to other accelerated stress test methods like temperature cycling and cyclic dynamic mechanical loading. Examples of modern interconnect designs covered are Canadian Solar Hetero Technology ribbon enabling closer cell interconnections, SmartWire (eg. Meyer-Berger technology), and shingled cells with new interconnect materials.

C-AST↗