Search NASA⌕ Search

Engineering topics

Boyce, Brad

Publications and source records attributed to Boyce, Brad.

5 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

BeyondFingerprinting: AI-guided discovery of robust materials & processes

BeyondFingerprinting was a 2021-2024 Sandia Grand Challenge LDRD exploring the potential to develop new resilient materials and manufacturing processes by taking an artificial-intelligence (AI)-guided approach that integrates human-subject-matter expertise with algorithms enriched with physics-based constraints to unearth process-structure-property correlations. Such algorithms, trained on high-throughput experiments and simulations, are shown to serve as surrogate models that efficiently detect key “fingerprints” in materials data, prognose material performance, and guide effective process improvements. To accelerate broader adoption across mission areas, this AI-guided approach was demonstrated with three complex process-centric exemplars: electroplating, physical vapor deposition, and laser powder bed fusion. Together, these exemplars impact nearly every hardware component relevant to DOE and NNSA national security missions.

36 MATERIALS SCIENCE↗
DOE OSTI2024

The Toughness of Interlocking Metasurfaces

Interlocking metasurfaces (ILMs) are arrays of autogenous latching unit cells patterned across a surface. These create structural joints similar to bioinspired suture joints but patterned over a 2D surface rather than a 1D seam. This enables ILMs to be an alternative to conventional joining technologies such as bolts, welds, and adhesives. However, compared to conventional joining methods, relatively little is known of the engineering considerations for designing structural ILMs. Herein, the interfacial toughness of an archetypal ILM is examined for the first time. Under the conditions studied here, the ILM is substantially tougher than the material from which it is made, in this case, exhibiting up to a 50% increase in interfacial crack initiation energy over the solid base material, a photocured 3D‐printed polymer. Through experimental tests using in‐situ digital image correlation along with complementary computational analyses, the mechanism of toughening in the ILM structure and the origins of toughness anisotropy are revealed. The increase in toughness is associated with cross‐cell interactions, that is, load‐sharing across unit cells, which give rise to a finite process zone length with different effective material properties. In this way, ILM toughening is analogous to crack blunting in ductile materials or fiber bridging in composites; yet here, the ILM is composed of a single‐phase base material and so the architected toughening is geometric in nature and hence amenable to future topological optimization.

fracture↗
DOE OSTI2023

Structural metamaterials comprising interpenetrating lattices

Multi-body interpenetrating lattices comprise two or more lattices that interlace or interpenetrate through the same volume without any direct physical connection to each other, wherein energy transfer is controlled by surface interactions. As a result, multifunctional or composite-like responses can be achieved by additive manufacturing of the interpenetrating lattices, even with only a single print material, with programmable interface-dominated properties. As a result, the interpenetrating lattices can have unique mechanical properties, including improved toughness, multi-stable/negative stiffness, and electromechanical coupling.

Boyce, Brad↗