Engineering topics

Burks, Harold D.

Publications and source records attributed to Burks, Harold D..

8 records

NASA NTRS1993

Polyimide processing additives

A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly-(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15 percent by weight of the additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

Pratt, J. Richard↗

NASA NTRS1992

Polyimide processing additives

A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly-(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15 percent by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

Fletcher, James C.↗

NASA NTRS1989

Copolyimide with a combination of flexibilizing groups

Copolyimides are prepared by reacting one or more aromatic dianhydrides with a meta-substituted phenylene diamine and an aromatic bridged diamine. The incorporation of meta-substituted phenylene diamine derived units and bridged aromatice diamine derived units into the linear aromatic polymer backbone results in a copolyimide of improved flexibility, processability, and melt-flow characteristics. The copolyimides are especially useful as thermoplastic hot-melt adhesives.

Stclair, Terry L.↗

NASA NTRS1988

Additives Improve Processing Of Polyimides

Melt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.

St. Clair, Terry L.↗

NASA NTRS1987

High temperature polyimide blends

In a continuing effort to synthesize polymers that are readily processable and that exhibit state-of-the-art characteristics, LARC-TPI (Mitsui) and polyimidesulfone (PISO2) were blended and subjected to a limited melt flow and thermal properties characterization. Mitsui Toatsu of Japan, working under a licensing agreement with NASA, synthesized an imidized version of LARC-TPI molding powder that exhibited an extraordinarily high level of softening when heated to 300 C. Subsequently, a study of the calorimetric and rheological properties was accomplished by NASA-Langley on that material. The thermoplastic polyimidesulfone that possesses processability similar to polysulfones and the solvent resistance of the polyimides was synthesized and characterized at NASA-Langley in the early 1980's.

Burks, Harold D.↗

NASA NTRS1987

Copolyimides With Flexibilizing Groups

Copolymers improved flexibility, processability and melt-flow characteristics. Copolyimide of new type exhibits synergistic improvements in flow properties due to flexibilized diamine-derived units incorported into polymer backbone. Technique produces copolyimides with combination of flexible linkage that cause polymers to exhibit flow properties particularly well suited for use in wide range of products including adhesives, molding resins, laminating resins, dielectric and protective coatings. Improved properties make copolymers especially useful as thermoplastic hot-melt adhesives.

St. Clair, Terry L.↗

NASA NTRS1987

Siloxane-modified polyethersulfideimide

BDSDA/APB, a novel linear polyethersulfideimide, was synthesized using siloxane units as flexible linkages in the backbone in an attempt to improve use properties and processability. The effect of these flexible linkages on molecular weight buildup, flexural strength and modulus, glass transition temperature, and melt-flow properties was determined.

Burks, Harold D.↗

NASA NTRS1986

Characterization of crystalline LARC-TPI powder

LARC-TPI, a linear aromatic polyimide, developed by NASA Langley Research Center in the late 1970's had thermoplastic character, but its melt-flow properties were much lower than those of conventional thermoplastics. An imidized version of the LARC-TPI molding powder was submitted to NASA-Langley for evaluation. The initial broad melt of this material occurs in the 270 C range and reorders to higher melting forms, depending on the physical and thermal treatments. Rheological characterization of this polymer shows it to have a very low melt viscosity, which increases as the melted specie transforms to other crystalline forms with higher melting temperatures.

Burks, Harold D.↗