Engineering topics
Publications and source records attributed to Chan, R..
A single event upset (SEU)-hardened flip-flop has been designed and developed for antifuse Field Programmable Gate Array (FPGA) application. Design and application issues, testability, test methods, simulation, and results are discussed.
The adhesion of insects to aircraft wings is studied. Insects were collected in road tests in past studies and a large experimental error was introduced caused by the variability of insect flux. The presence of such errors has been detected by studying the insect distribution across an aluminum-strip covered half-cylinder mounted on the top of a car. After a nonuniform insect distribution (insect flux) was found from three road tests, a new arrangement of samples was developed. The feasibility of coating aircraft wing surfaces with polymers to reduce the number of insects sticking onto the surfaces was studied using fluorocarbon elastomers, styrene butadiene rubbers, and Teflon.
Programming language for computerized circuit design and analysis, considering techniques for input statements translation