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Chan, S. T. K.

Publications and source records attributed to Chan, S. T. K..

Space shuttle contamination due to backflow from control motor exhaust

Spacecraft contamination of the space shuttle orbiter and accompanying Spacelab payloads is studied. The scattering of molecules from the vernier engines and flash evaporator nozzle after impingement on the orbiter wing surfaces, and the backflow of molecules out of the flash evaporator nozzle plume flow field due to intermolecular collisions in the plume are the problems discussed. A method was formulated for dealing with these problems, and detailed results are given.

Robertson, S. J.↗

Analysis of transonic flow over lifting and oscillating airfoils

Finite element procedures are presented for the numerical solution of transonic flow over lifting and oscillating airfoils based on small disturbance theory. The algorithm is simple and effective in handling the mixed flow problem and, for airfoil in free air, treats the entire flow domain by making use of the far field asymptotic solution. Numerical results are presented and compared with experimental data and those obtained by finite difference relaxation techniques.

Chan, S. T. K.↗

Three-dimensional finite element analysis for high velocity impact

A finite element algorithm for solving unsteady, three-dimensional high velocity impact problems is presented. A computer program was developed based on the Eulerian hydroelasto-viscoplastic formulation and the utilization of the theorem of weak solutions. The equations solved consist of conservation of mass, momentum, and energy, equation of state, and appropriate constitutive equations. The solution technique is a time-dependent finite element analysis utilizing three-dimensional isoparametric elements, in conjunction with a generalized two-step time integration scheme. The developed code was demonstrated by solving one-dimensional as well as three-dimensional impact problems for both the inviscid hydrodynamic model and the hydroelasto-viscoplastic model.

Chan, S. T. K.↗