Transfer of EP and Doping Technology for PIP-II HB650 Cavities from Fermilab to Industry
Fermilab has optimized the surface processing conditions for PIP-II high beta 650 MHz cavities. This encompasses conditions for bulk electropolishing, heat treatment, nitrogen doping, post-doping final electropolishing, and post-processing surface rinsing. The technology has been effectively transitioned to industry. This paper highlights the efforts made to fine-tune the process and to smoothly share them with the partner labs and an associated vendor.