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Chawla, Nikhilesh

Publications and source records attributed to Chawla, Nikhilesh.

5 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Analysis of electrically conductive adhesives in shingled solar modules by X-ray imaging techniques

The failure mechanisms of electrically conductive adhesives (ECAs) in solar modules are difficult to study since the ECA layer is not easily accessible within the module package. In this work, we present two complementary imaging modalities—X-ray radiography and X-ray microcomputed tomography (XCT)—that reveal important morphological features of the ECA within a shingled module. X-ray radiography uses single X-ray projections to provide fast and non-destructive imaging of the shingled interconnection, illuminating the alignment of the ECA relative to the busbars, the size and shape of the ECA, and the presence of voids within it. Through X-ray radiography, we observed, for example, that the average void coverage area of ECA segments reduced from 36.7% to 4.4% when an ECA was cured for 60 s prior to module lamination. XCT is a three-dimensional imaging technique that can identify regions in which the ECA makes electrical contact to busbars on cells and regions in which the ECA has cracked, among other features. XCT can also be used to image the individual metal particles within ECA, from which the metal volume fraction of an ECA was found here to be 70.4%. This is a quantity that is not often reported by ECA manufacturers but is important to ensure isotropic conduction. As X-ray projections can be performed non-destructively on full modules, the technique may be used to pinpoint ECA failures in accelerated degradation testing. XCT is complementary and is suited to forensic analysis of failing modules.

14 SOLAR ENERGY↗
DOE OSTI2021

Machine-Learning-based Algorithms for Automated Image Segmentation Techniques of Transmission X-ray Microscopy (TXM)

Four state-of-the-art Deep Learning-based Convolutional Neural Networks (DCNN) were applied to automate the semantic segmentation of a 3D Transmission x-ray Microscopy (TXM) nanotomography image data. The standard U-Net architecture as baseline along with UNet++, PSPNet, and DeepLab v3+ networks were trained to segment the microstructural features of an AA7075 micropillar. A workflow was established to evaluate and compare the DCNN prediction dataset with the manually segmented features using the Intersection of Union (IoU) scores, time of training, confusion matrix, and visual assessment. Comparing all model segmentation accuracy metrics, it was found that using pre-trained models as a backbone along with appropriate training encoder-decoder architecture of the Unet++ can robustly handle large volumes of x-ray radiographic images in a reasonable amount of time. This opens a new window for handling accurate and efficient image segmentation of in situ time-dependent 4D x-ray microscopy experimental datasets.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Poisson’s ratio of eTPU molded bead foams in compression via in situ synchrotron X-ray microtomography

In situ synchrotron X-ray microtomography was used to characterize the bulk deformation behavior by computing the Poisson's ratio of expanded thermoplastic polyurethane (eTPU) molded bead foams used in footwear midsole during compression. Quantitative data on morphological characteristics were obtained using an iterative image processing workflow. Image correlation on the 4D datasets using DVC was performed to calculate the volumetric and axial strain to estimate the Poisson ratio. Strain maps from DVC showed the influence of variability in ligament thickness distribution on the global mechanical behavior exhibited which dominated the response seen in these bead foams. Lastly, our results showed a strong correlation between Poisson ratio and distribution of ligament thickness in foams.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Activation Energy for End-of-Life Solder Bond Degradation: Thermal Cycling of Field-Aged PV Modules

The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.

14 SOLAR ENERGY↗