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Chow, L. C.

Publications and source records attributed to Chow, L. C..

Vaporization heat transfer of dielectric liquids on enhanced surfaces covered with screen wicks

Experiments were conducted to investigate the vaporization heat transfer characteristics for the dielectric liquid FC-72 on several wicking surfaces which may be used in flat-plate heat pipes. The wicking materials studied included microstructure enhanced surfaces and coarse surfaces covered with screen meshes. Experimental data for q versus deltaT curves and critical heat fluxes were obtained for the two different operating conditions of a heat pipe, evaporation, and shallow pool boiling. When the liquid level was above the heated surface, the height of the liquid level above the surface was varied from 0 to 10 mm. When the liquid level was below the heated surface, the distance from the liquid level to the edge of the surface was adjusted from 0 to 15 mm. Experimental results revealed that for shallow pool boiling when the heated surface was covered with a wire screen mesh, the heat transfer coefficient increased at lower heat fluxes but the critical heat flux (CHF) decreased for all the surfaces tested. In the case of evaporation, both CHF and the heat transfer coefficient increased as the microstructure surfaces were covered with screen meshes.

Gu, C. B.↗

Vaporization heat transfer of dielectric liquids on a wick-covered surface

Vaporization heat transfer characteristics were measured for the dielectric liquid FC-72 on a horizontal heated surface covered with wire screen wicks with the mesh number for the screens varying from 24 to 100. In such a situation the liquid level can be either higher or lower than the heated surface. When the liquid level was above the heated surface (shallow pool boiling), the height of the liquid level above the surface, h, was varied from 0 to 10 mm. When the liquid level was below the heated surface (evaporation through capillary pumping), the distance from the liquid level to the edge of the surface, L, was adjusted from 0 to 15 mm. Experimental data revealed that the critical heat flux (CHF) decreases as the mesh number is increased from 24 to 100 for both vaporation and shallow pool boiling, showing that the vapor-escaping limit is more important than the capillary limit in flat plate heat pipe application.

Gu, C. B.↗

Condensation heat transfer under a microgravity environment

A description of the condensation heat transfer process in microgravity is given. A review of the literature is also reported. The most essential element of condensation heat transfer in microgravity is the condensate removal mechanism. Two mechanisms for condensate removal are analyzed by looking into two problems. The first problem is concerned with film condensation on a flat porous plate with the condensate being removed by suction at the wall. The second problem is an analytical prediction of the heat transfer coefficient for condensing annular flows with the condensate film driven by the vapor shear. It is concluded that both suction and vapor shear can effectively drain the condensate to ensure continuous operation of the condensers operated under a microgravity environment. It is recommended that zero-g flight experiments be carried out to verify the prediction made in the present report. The results contained in this report should also aid in the design of future space condensers.

Chow, L. C.↗

Condensation heat transfer in a microgravity environment

In the present treatment of the condensation heat transfer process in a microgravity environment, two mechanisms for condensate removal are analyzed in light of two problems: (1) film condensation on a flat, porous plate, with condensate being removed by wall suction; and (2) the analytical prediction of the heat transfer coefficient of condensing annular flows, where the condensate film is driven by vapor shear. Both suction and vapor shear can effectively drain the condensate, ensuring continuous operation in microgravity.

Chow, L. C.↗