NASA NTRS2005
The next generation of planetary exploration vehicles will rely heavily on robust aero-assist technologies, especially those that include aerocapture. This paper provides an overview of an ongoing development program, led by NASA Langley Research Center (LaRC) and aimed at introducing high-temperature structures, adhesives, and advanced thermal protection system (TPS) materials into the aeroshell design process. The purpose of this work is to demonstrate TPS materials that can withstand the higher heating rates of NASA's next generation planetary missions, and to validate high-temperature structures and adhesives that can reduce required TPS thickness and total aeroshell mass, thus allowing for larger science payloads. The effort described consists of parallel work in several advanced aeroshell technology areas. The areas of work include high-temperature adhesives, high-temperature composite materials, advanced ablator (TPS) materials, sub-scale demonstration test articles, and aeroshell modeling and analysis. The status of screening test results for a broad selection of available higher-temperature adhesives is presented. It appears that at least one (and perhaps a few) adhesives have working temperatures ranging from 315-400 C (600-750 F), and are suitable for TPS-to-structure bondline temperatures that are significantly above the traditional allowable of 250 C (482 F). The status of mechanical testing of advanced high-temperature composite materials is also summarized. To date, these tests indicate the potential for good material performance at temperatures of at least 600 F. Application of these materials and adhesives to aeroshell systems that incorporate advanced TPS materials may reduce aeroshell TPS mass by 15% - 30%. A brief outline is given of work scheduled for completion in 2006 that will include fabrication and testing of large panels and subscale aeroshell test articles at the Solar-Tower Test Facility located at Kirtland AFB and operated by Sandia National Laboratories. These tests are designed to validate aeroshell manufacturability using advanced material systems, and to demonstrate the maintenance of bondline integrity at realistically high temperatures and heating rates. Finally, a status is given of ongoing aeroshell modeling and analysis efforts which will be used to correlate with experimental testing, and to provide a reliable means of extrapolating to performance under actual flight conditions. The modeling and analysis effort includes a parallel series of experimental tests to determine TSP thermal expansion and other mechanical properties which are required for input to the analysis models.