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Cooper, Ken B.

Publications and source records attributed to Cooper, Ken B..

Modeling Broadband Phase Noise from Extended Targets in a 170 GHz Cloud-Imaging Radar

VIPR (Vapor Inside-cloud Profiling Radar) is a differential absorption radar operating over 155-175 GHz, covering a portion of the lower frequency flank of the 183 GHz water vapor absorption resonance. Transmitting at a ~1.9 mm wavelength, VIPR is highly sensitive to scattering from small particles comprising clouds and precipitation. Variation of VIPR’s cloud and precipitation echo power with frequency is often dominated by water vapor absorption, allowing humidity profiles to be retrieved along the radar’s beam path. One confounding effect in practical measurements is phase noise carried by the radar’s transmit signal, which can result in strong range sidelobes extending from bright targets and obscuring the echo signals of more weakly scattering clouds. Here we show that the magnitude and shape of phase-noise induced clutter from extended, bright cloud signals can be accurately modeled using a combination of empirical measurements of surface-echo phase noise and an analytic model based on the phase-noise sidelobe magnitude from a theoretical point target. This improved understanding of a potential clutter source in millimeter-wave imagine radar can lead to better performance modeling, and it provides motivation to improve the phase noise of very high frequency local oscillators.

Cooper, Ken B.

An upgraded G-band differential absorption radar system for future airborne studies

A proof-of-concept, 170 GHz frequency-modulated, continuous-wave (FMCW) radar has been developed for measuring water vapor profiles within the cloudy boundary layer from an airborne platform. The measurement concept exploits the differential absorption accrued by two or more transmitted frequencies in the vicinity of the 183 GHz water absorption line to retrieve range-resolved humidity profiles, so-called differential absorption radar (DAR). The upgraded system design includes important considerations for monostatic radar operation with an open fuselage viewport (i.e. no radome). The radar features an all-solid-state tansmitter with > 0:4 W continuous transmit power, a 60 cm primary aperture and corresponding 58 dB antenna gain, and more than 80 dB transmit/receive isolation, enabling near thermal-noise-limited sensitivity with a 8 dB noise figure receiver. Ice-cloud radar returns are detected beyond 8 km in height from the ground, demonstrating the high sensitivity of the system. In addition to in-cloud humidity profiling capabilities, deployment of a water vapor DAR from an airborne platform enables measurements of total column water vapor (TCWV) for all weather and surface scenarios. Precision estimates and potential biases for future TCWV measurements are discussed.

Monje, Raquel

Wafer-To-Wafer Alignment Method

A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.

Jung-Kubiak, Cecile

Differential Absorption Radar at 170 GHz for Atmospheric Boundary Layer Water Vapor Profiling

We are developing a frequency-modulated continuous-wave (FMCW) radar between 167 and 174.8 GHz to measure differential absorption due to water vapor within the atmospheric boundary layer. In this work, we report on single-frequency measurements performed within this band in the presence of precipitating clouds. Despite the relatively low transmit power of 6-10 dBm, the high transmit/receive isolation and low noise figure of the system enables detection of radar echos from rain or clouds with high signal-to-noise ratio (SNR) out to about one kilometer. Near future upgrades to the system that will lengthen significantly the detectable range include a 15 to 20 dB increase in output power and 20 dB increase in antenna gain. This work builds on technology developed and measurements performed in our group in the 183.5 to 193 GHz band, which is subject to transmission restrictions due to passive remote sensing platforms that rely on those frequencies.

Rodriguez Monje, Raquel

High Power W-Band/F-Band Schottky Diode Based Frequency Multipliers

A solid state device chip including diodes (generating a higher frequency output through frequency multiplication of the input frequency) and a novel on-chip power combining design. Together with the on-chip power combining, the chip has increased efficiency because the diodes' anodes, being micro-fabricated simultaneously on the same patch of a GaAs wafer under identical conditions, are very well balanced. The diodes' GaAs heterostructure and the overall chip geometry are designed to be optimized for high power operation. As a result of all these features, the device can generate record-setting power having a signal frequency in the F-band and W-band (30% conversion efficiency).

Siles Perez, Jose Vicente

G-band FMCW Radar for Humidity Profiling Inside Boundary Layer Clouds

We are developing a G-band FMCW radar for remote sensing of vertical water vapor profiles and total column water vapor. The radar utilizes the frequency-dependent absorption near the 183 GHz water absorption line to obtain a differential signal from which we can derive range-resolved humidity measurements. This proof-of-concept instrument will eventually be tested from an airborne platform. In this report, we discuss recent measurements and a humidity profile retrieval algorithm based on an absorption line shape fitting model

Monje, Raquel

340 Ghz Multipixel Transceiver

A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.

Chattopadhyay, Goutam

Multi-Step Deep Reactive Ion Etching Fabrication Process for Silicon-Based Terahertz Components

A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

Jung-Kubiak, Cecile

Silicon Alignment Pins: An Easy Way to Realize a Wafer-to-Wafer Alignment

Submillimeter heterodyne instruments play a critical role in addressing fundamental questions regarding the evolution of galaxies as well as being a crucial tool in planetary science. To make these instruments compatible with small platforms, especially for the study of the outer planets, or to enable the development of multi-pixel arrays, it is essential to reduce the mass, power, and volume of the existing single-pixel heterodyne receivers. Silicon micromachining technology is naturally suited for making these submillimeter and terahertz components, where precision and accuracy are essential. Waveguide and channel cavities are etched in a silicon bulk material using deep reactive ion etching (DRIE) techniques. Power amplifiers, multiplier and mixer chips are then integrated and the silicon pieces are stacked together to form a supercompact receiver front end. By using silicon micromachined packages for these components, instrument mass can be reduced and higher levels of integration can be achieved. A method is needed to assemble accurately these silicon pieces together, and a technique was developed here using etched pockets and silicon pins to align two wafers together.

Jung-Kubiak, Cecile

Automatic Focusing for a 675 GHz Imaging Radar with Target Standoff Distances from 14 to 34 Meters

This paper dicusses the issue of limited focal depth for high-resolution imaging radar operating over a wide range of standoff distances. We describe a technique for automatically focusing a THz imaging radar system using translational optics combined with range estimation based on a reduced chirp bandwidth setting. The demonstarted focusing algorithm estimates the correct focal depth for desired targets in the field of view at unknown standoffs and in the presence of clutter to provide good imagery at 14 to 30 meters of standoff.

automatic focus

Multi-pixel high-resolution three-dimensional imaging radar

A three-dimensional imaging radar operating at high frequency e.g., 670 GHz radar using low phase-noise synthesizers and a fast chirper to generate a frequency-modulated continuous-wave (FMCW) waveform, is disclosed that operates with a multiplexed beam to obtain range information simultaneously on multiple pixels of a target. A source transmit beam may be divided by a hybrid coupler into multiple transmit beams multiplexed together and directed to be reflected off a target and return as a single receive beam which is demultiplexed and processed to reveal range information of separate pixels of the target associated with each transmit beam simultaneously. The multiple transmit beams may be developed with appropriate optics to be temporally and spatially differentiated before being directed to the target. Temporal differentiation corresponds to a different intermediate frequencies separating the range information of the multiple pixels. Collinear transmit beams having differentiated polarizations may also be implemented.

Cooper, Ken B.

Improvements in Speed and Functionality of a 670-GHz Imaging Radar

Significant improvements have been made in the instrument originally described in a prior NASA Tech Briefs article: Improved Speed and Functionality of a 580-GHz Imaging Radar (NPO-45156), Vol. 34, No. 7 (July 2010), p. 51. First, the wideband YIG oscillator has been replaced with a JPL-designed and built phase-locked, low-noise chirp source. Second, further refinements to the data acquisition and signal processing software have been performed by moving critical code sections to C code, and compiling those sections to Windows DLLs, which are then invoked from the main LabVIEW executive. This system is an active, single-pixel scanned imager operating at 670 GHz. The actual chirp signals for the RF and LO chains were generated by a pair of MITEQ 2.5 3.3 GHz chirp sources. Agilent benchtop synthesizers operating at fixed frequencies around 13 GHz were then used to up-convert the chirp sources to 15.5 16.3 GHz. The resulting signals were then multiplied 36 times by a combination of off-the-shelf millimeter- wave components, and JPL-built 200- GHz doublers and 300- and 600-GHz triplers. The power required to drive the submillimeter-wave multipliers was provided by JPL-built W-band amplifiers. The receive and transmit signal paths were combined using a thin, high-resistivity silicon wafer as a beam splitter. While the results at present are encouraging, the system still lacks sufficient speed to be usable for practical applications in a contraband detection. Ideally, an image acquisition speed of ten seconds, or a factor of 30 improvement, is desired. However, the system improvements to date have resulted in a factor of five increase in signal acquisition speed, as well as enhanced signal processing algorithms, permitting clearer imaging of contraband objects hidden underneath clothing. In particular, advances in three distinct areas have enabled these performance enhancements: base source phase noise reduction, chirp rate, and signal processing. Additionally, a second pixel was added, automatically reducing the imaging time by a factor of two. Although adding a second pixel to the system doubles the amount of submillimeter components required, some savings in microwave hardware can be realized by using a common low-noise source.

Dengler, Robert J.

Terahertz Array Receivers with Integrated Antennas

Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

direct detector arrays

High-resolution three-dimensional imaging radar

A three-dimensional imaging radar operating at high frequency e.g., 670 GHz, is disclosed. The active target illumination inherent in radar solves the problem of low signal power and narrow-band detection by using submillimeter heterodyne mixer receivers. A submillimeter imaging radar may use low phase-noise synthesizers and a fast chirper to generate a frequency-modulated continuous-wave (FMCW) waveform. Three-dimensional images are generated through range information derived for each pixel scanned over a target. A peak finding algorithm may be used in processing for each pixel to differentiate material layers of the target. Improved focusing is achieved through a compensation signal sampled from a point source calibration target and applied to received signals from active targets prior to FFT-based range compression to extract and display high-resolution target images. Such an imaging radar has particular application in detecting concealed weapons or contraband.

Cooper, Ken B.

Fast, High-Resolution Terahertz Radar Imaging at 25 Meters

We report improvements in the scanning speed and standoff range of an ultra-wide bandwidth terahertz (THz) imaging radar for person-borne concealed object detection. Fast beam scanning of the single-transceiver radar is accomplished by rapidly deflecting a flat, light-weight subreflector in a confocal Gregorian optical geometry. With RF back-end improvements also implemented, the radar imaging rate has increased by a factor of about 30 compared to that achieved previously in a 4 m standoff prototype instrument. In addition, a new 100 cm diameter ellipsoidal aluminum reflector yields beam spot diameters of approximately 1 cm over a 50x50 cm field of view at a range of 25 m, although some aberrations are observed that probably arise from misaligned optics. Through-clothes images of a concealed threat at 25 m range, acquired in 5 seconds, are presented, and the impact of reduced signal-to-noise from an even faster frame rate is analyzed. These results inform the system requirements for eventually achieving sub-second or video-rate THz radar imaging.

standoff concealed weapons detection