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Coteus, Paul W.

Publications and source records attributed to Coteus, Paul W..

Switch-connected Dragonfly network

A switch-connected dragonfly network and method of operating. A plurality of groups of row switches is organized according to multiple rows and columns, each row including multiple groups of row switches connected to form a two-level dragonfly network. A plurality of column switches interconnect groups of row switches along respective columns, a column switch associated with a corresponding group of row switches in a row. A switch port with a same logical port on a row switch at a same location in each group along the respective column connects to a same column switch. The switch-connected dragonfly network is expandable by adding additional rows, an added row comprising a two-level dragonfly network. A switch group of said added row associated with a column being connects to an available port at an existing column switch of said column by corresponding added S path link with no re-cabling of the switched network required.

Heidelberger, Philip↗

Smart controller with phantom inductor current sensing for switched mode power supplies

Voltage on the output terminal of an inductor is obtained as a first input signal to a control block (CB); the inductor has an input terminal connected to a power switch and driver block at a switching node. A sense input voltage is obtained on an output terminal of a sensing circuit that is not directly connected to the switching node, as a second input signal to the CB. A voltage is generated on a first output terminal of the CB and is selected such that the CB can use its first and second input signals to infer the current through the inductor. A pulse width modulation (PWM) signal is generated on a second output terminal of the CB, based on the inferred current through the inductor; the second output signal from the CB is provided to a PWM input terminal of the power switch and driver block.

Zhang, Xin↗

Burst resistant thin wall heat sink

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Coteus, Paul W.↗