Analysis of Cu-Ag and Ni-Pt High Throughput Survey Results
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Engineering topics
Publications and source records attributed to Custer, Joyce Olsen.
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BeyondFingerprinting was a 2021-2024 Sandia Grand Challenge LDRD exploring the potential to develop new resilient materials and manufacturing processes by taking an artificial-intelligence (AI)-guided approach that integrates human-subject-matter expertise with algorithms enriched with physics-based constraints to unearth process-structure-property correlations. Such algorithms, trained on high-throughput experiments and simulations, are shown to serve as surrogate models that efficiently detect key “fingerprints” in materials data, prognose material performance, and guide effective process improvements. To accelerate broader adoption across mission areas, this AI-guided approach was demonstrated with three complex process-centric exemplars: electroplating, physical vapor deposition, and laser powder bed fusion. Together, these exemplars impact nearly every hardware component relevant to DOE and NNSA national security missions.
Sputter-deposited Pt-Au thin films have been reported to develop a hard, stable, nanocrystalline structure, yet little is known about how these characteristics vary with Pt x Au 1-x composition and process conditions. Toward this end, this document describes an extensive, combinatorial Pt-Au thin film library including characterized film compositions, structure, and properties. Complemented by kinematic Monte Carlo simulations of codeposition, a broad range of Pt x Au 1-x compositions (from x ~ 0.02 to 0.93) was first established by sputtering with varied magnetron powers and gun tilt angles. Further, the produced films were subsequently interrogated using automated nanoindentation, x-ray reflectivity, x-ray diffraction, atomic force microscopy, surface profilometry, four-point probe sheet resistance techniques, and wavelength dispersive spectroscopy in order to determine how hardness, modulus, density, surface roughness, structure, and resistivity vary with film stoichiometry and process parameters. Combinatorial films displayed an assortment of properties with the hardness of some films exceeding values reported previously for this material system. High hardness, high modulus, and low resistivity were generally attained when using increased deposition energy and reduced angle-of-incidence processes. Overall, the research identified promising, new Pt x Au 1-x compositions for future study and pinpointed strategies for improved deposition.
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Multimodal datasets of materials are rich sources of information which can be leveraged for expedited discovery of process–structure–property relationships and for designing materials with targeted structures and/or properties. For this data descriptor article, we provide a multimodal dataset of magnetron sputter-deposited molybdenum (Mo) thin films, which are used in a variety of industries including high temperature coatings, photovoltaics, and microelectronics. In this dataset we explored a process space consisting of 27 unique combinations of sputter power and Ar deposition pressure. Here, the phase, structure, surface morphology, and composition of the Mo thin films were characterized by x-ray diffraction, scanning electron microscopy, atomic force microscopy, and Rutherford backscattering spectrometry. Physical properties—namely, thickness, film stress and sheet resistance—were also measured to provide additional film characteristics and behaviors. Additionally, nanoindentation was utilized to obtain mechanical load-displacement data. The entire dataset consists of 2072 measurements including scalar values (e.g., film stress values), 2D linescans (e.g., x-ray diffractograms), and 3D imagery (e.g., atomic force microscopy images). An additional 1889 quantities, including film hardness, modulus, electrical resistivity, density, and surface roughness, were derived from the experimental datasets using traditional methods. Minimal analysis and discussion of the results are provided in this data descriptor article to limit the authors’ preconceived interpretations of the data. Overall, the data modalities are consistent with previous reports of refractory metal thin films, ensuring that a high-quality dataset was generated. The entirety of this data is committed to a public repository in the Materials Data Facility.
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Sandia National Laboratories is developing a way to visualize molecular changes that indicate penetration of a tamper-indicating enclosure (TIE). Such "bleeding" materials (analogous to visually obvious, colorful bruised skin that doesn't heal) allows inspectors to use simple visual observation to readily recognize that penetration into a material used as a TIE has been attempted, without providing adversaries the ability to repair damage. Such a material can significantly enhance the current capability for TIEs, used to support treaty verification regimes. Current approaches rely on time-consuming and subjective visual assessment by an inspector, external equipment, such as eddy current or camera devices, or active approaches that may be limited due to application environment. The complexity of securing whole volumes includes: (1) enclosures that are non-standard in size/shape; (2) enclosures that may be inspectorate- or facility-owned; (3) tamper attempts that are detectable but difficult or timely for an inspector to locate; (4) the requirement for solutions that are robust regarding reliability and environment (including facility handling); and (5) the need for solutions that prevent adversaries from repairing penetrations. The approach is based on a transition metal ion solution within a microsphere changing color irreversibly when the microsphere is ruptured. Investigators examine 3D printing of the microspheres as well as the spray coating formulation. The anticipated benefits of this work are passive, flexible, scalable, cost-effective TIEs with obvious and robust responses to tamper attempts. This results in more efficient and effective monitoring, as inspectors will require little or no additional equipment and will be able to detect tamper without extensive time-consuming visual examination. Applications can include custom TIEs (cabinets or equipment enclosures), spray-coating onto facility-owned items, spray-coating of walls or structures, spray-coatings of circuit boards, and 3D-printed seal bodies. The paper describes research to-date on the sensor compounds and microspheres.