Engineering topics
Publications and source records attributed to Dassele, M. A..
Modified die-bonding machine speeds up hybrid-circuit production. Utilizing two pedestals, one for die tray and another for substrate tray, increased production and decreased error-margin are possible.
Wire-drag system improves wire profile and applies consistent drag to wire. Wire drag is continuously adjustable from zero drag to tensile strength of wire. No-sag wire drag is easier to thread than former system and requires minimal downtime for cleaning and maintenance.