Engineering topics
Publications and source records attributed to Dawe, R. H..
Spring clips seal housings for electronic circuitry, preventing electromagnetic interference from entering or leaving housings. Clips also keep dust out of housing. Since no bolts are used, housing can be opened quickly; unlike bolts, clips can be used on thin-walled housing. Seal was developed for an X-band array amplifier.
Report presents study of weight savings in electric vehicles by using alternative structural materials, particularly composites. Topics discussed include safety, aerodynamics, esthetics, and cost.
Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.
Thermoelectric outer planet spacecraft /TOPS/ structural problems associated with high gain antenna and electronic equipment