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Del Castillo, Linda

Publications and source records attributed to Del Castillo, Linda.

Extreme Environment Capable, Modular and Scalable Power Processing Unit for Solar Electric Propulsion

This paper is to present a concept of a modular and scalable High Temperature Boost (HTB) Power Processing Unit (PPU) capable of operating at temperatures beyond the standard military temperature range. The various extreme environments technologies are also described as the fundamental technology path to this concept. The proposed HTB PPU is intended for power processing in the area of space solar electric propulsion, where the reduction of in-space mass and volume are desired, and sometimes even critical, to achieve the goals of future space flight missions. The concept of the HTB PPU can also be applied to other extreme environment applications, such as geothermal and petroleum deep-well drilling, where higher temperature operation is required.

Electronics

Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

Hoffman, James Patrick

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

Deformation, Ecosystem Structure, and Dynamics of

Large Aperture, Scanning, L-Band SAR

We have developed the first L-band membrane-based active phased array. The antenna is a 16x16 element patch array with dimensions of 2.3mx2.6m. The array uses membrane-compatible Transmit/Receive (T/R) modules for electronic beam steering. We will discuss the antenna design, the fabrication of this large array, the T/R module development, the signal distribution approach and the measured results of the array.

defense related phased array

Aperture-coupled thin-membrane microstrip array antenna for beam scanning application

A microstrip array using aperture-slot-coupling technique with very thin membranes has been developed at the L-band frequency for beam scanning application. This technology-demonstration array with 4 x 2 elements achieved a relatively wide bandwidth of 100 MHz (8%) and +/-45(deg) beam scan. Very narrow coupling slots were used with each having an aspect ratio of 160 (conventional slot aspect ratio is between 10 to 30) for coupling through very thin membrane (0.05mm thickness). This thin-membrane aperture-coupling technique allows the array antenna elements to be more easily integrated with transmit/receive amplifier (T/R) and phase shifter modules. This paper addresses only the radiator portion of the array. The array and active components will be presented in a separate pape.

array antenna

Active membrane phased array radar

We have developed the first membrane-based active phased array in L-band (1.26GHz). The array uses membrane compatible Transmit/Receive (T/R) modules (membrane T/R) for each antenna element. We use phase shifters within each T/R module for electronic beam steering. We will discuss the T/R module design and integration with the membrane, We will also present transmit and receive beam-steering results for the array.

membrane arrays

A miniaturized neuroprosthesis suitable for implantation into the brain

This paper presents current research on a miniaturized neuroprosthesis suitable for implantation into the brain. The prosthesis is a heterogeneous integration of a 100-element microelectromechanical system (MEMS) electrode array, front-end complementary metal-oxide-semiconductor (CMOS) integrated circuit for neural signal preamplification, filtering, multiplexing and analog-to-digital conversion, and a second CMOS integrated circuit for wireless transmission of neural data and conditioning of wireless power. The prosthesis is intended for applications where neural signals are processed and decoded to permit the control of artificial or paralyzed limbs. This research, if successful, will allow implantation of the electronics into the brain, or subcutaneously on the skull, and eliminate all external signal and power wiring. The neuroprosthetic system design has strict size and power constraints with each of the front-end preamplifier channels fitting within the 400 x 400-microm pitch of the 100-element MEMS electrode array and power dissipation resulting in less than a 1 degree C temperature rise for the surrounding brain tissue. We describe the measured performance of initial micropower low-noise CMOS preamplifiers for the neuroprosthetic.

Action Potentials/physiology