Engineering topics

Delos, S. E.

Publications and source records attributed to Delos, S. E..

4 records

NASA NTRS1987

Monitoring processing properties of high performance thermoplastics using frequency dependent electromagnetic sensing

An in situ NDE dielectric impedance measurement method has been developed for ascertaining the cure processing properties of high temperature advanced thermoplastic and thermosetting resins, using continuous frequency-dependent measurements and analyses of complex permittivity over 9 orders of magnitude and 6 decades of frequency at temperatures up to 400 C. Both ionic and Debye-like dipolar relaxation processes are monitored. Attention is given to LARC-TPI, PEEK, and poly(arylene ether) resins' viscosity, glass transition temperature, recrystallization, and residual solvent content and evolution properties.

Kranbuehl, D. E.↗

NASA NTRS1986

Dynamic dielectric analysis - A nondestructive cure process monitoring method

The cure processes of TGDDM-based epoxy thermosets and polysulfone thermoplastic resins were monitored by means of computer-controlled dynamic dielectric measurements made at frequencies 5 Hz to 5 million Hz. The values of capacitance and conductance were recorded, and the data were used to calculate the complex permittivity, an intensive property which is characteristic of the material's state of cure and independent of the amount of material measured. The frequency dependence of the complex permittivity value was used to determine the conductivity and mean relaxation time. The conductivity which is also an intensive variable and is independent of sample size, was correlated with the viscosity in both the epoxy and polysulfone systems.

Kranbuehl, D. E.↗

NASA NTRS1986

Dynamic dielectric analysis for nondestructive cure monitoring and process control

Dynamic dielectric analysis (DDA) is an effective in situ NDE method that can monitor the reaction status in thermosets and the phase changes in thermoplastics, including slow reactions occuring late in the cure cycle and recrystallization during annealing. The effects of moisture and resin history on reaction rate can also be determined, as can ionic and dipolar contributions. The ionic mobility parameter is noted to be an excellent monitor of viscosity above the glass transition temperature. The ability of DDA to monitor cure rate variations in a thick section during autoclaving has been demonstrated.

Kranbuehl, D. E.↗

NASA NTRS1984

Dynamic dielectric characterization of thermosets and thermoplastics using intrinsic variables

Dynamic dielectric analysis has been used to study curing polymer systems and thermoplastics. Measurements have been made over a frequency range of six decades. The data are analyzed in terms of capacitance, conductance, dissipation, complex permittivity, and conductivity (sigma). Complex permittivity and sigma are properties which are characteristic of the cure state of the material and independent of the size of the sample. LARC-160, PMR-15, NARMCO 5208, Epon and UDEL-P1700 have been studied. The experimental results suggest that when ionic processes dominate the dielectric response, the intensive property sigma is a good monitor of the resin's viscosity.

Kranbuehl, D. E.↗