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Diamond, Louis

Publications and source records attributed to Diamond, Louis.

Radiopaque particle processing additive

A radiopaque processing medium comprising a plurality of radiopaque particles and a non-radiopaque processing medium. The plurality of radiopaque particles is added to the non-radiopaque processing medium to increase a bulk density of the processing medium thereby forming the radiopaque processing medium. The radiopaque processing medium allows excess process media to be located and characterized during X-ray inspection of an electronic device on which the radiopaque processing medium was used. The radiopaque processing medium may also be used to locate and identify flaws/defects of the electronic device based on the location of excess radiopaque processing medium. The radiopaque processing medium may also be used as an underfill material to reinforce electronic chips soldered to the electronic device.

Diamond, Louis↗

Requirements for Soldering Fluxes Research using the B-53 Test Board

IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of soldering materials through specifications of test methods and inspection criteria. The materials include liquid flux, paste flux, solderpaste flux, solder preform flux, and flux-cored solder. This research will use the proposed IPC-53 Surface Insulation Resistance (SIR) test patterns by means of an open comb (2D) and closed comb (3D to simulate a component over the comb pattern). The 2D open comb has uniformity of conductor spacing, sheet resistance, and flux outgassing. The 3D-closed comb simulates the effect of leadless or bottom-terminated components, which have non-uniform sheet resistance and flux outgassing. The response variables will include SIR testing and visual imaging. The objective is to investigate IPC test method improvements for characterizing soldering fluxes when using leadless components with narrow pad-to-pad spacing.

Diamond, Louis↗