Engineering topics
Publications and source records attributed to Dickerson, G. E..
Void free moldings obtained for neat, condensation, thermosetting resins. Thermally and mechanically treat resin prior to molding to reduce amount of volatiles. With volatiles reduced molding temperature and pressure are applied in way to drive out remaining volatiles during molding.
To prepare an epoxy thin film, quantity of uncured epoxy to be cast placed in vacuum oven and heated to melting temperature. Vacuum of about 30 mm Hg is applied to deaerate epoxy charge. Pressure is cycled with each foaming until all air and excess volatiles are revoved. thermoset (cross-linked) resin is cast between thin, flexible, releasing substrate films. Films less than 0.025 mm in thickness are made routinely with this facility.
Technique which improves fiber alignment and reduces void content of thick laminated structures is readily applicable to structures that contain sections such as ribs, channels, or bosses joined to thin stems of same material.
A process was developed for preparing relatively thick composite laminate structure wherein thin layers of prepreg tapes are assembled, these thin layers are cut into strips that are partially cured, and stacked into the desired thickness with uncured prepreg disposed between each layer of strips. The formed laminate is finally cured and thereafter machined to the desired final dimensions.