Engineering topics
Dickerson, Jeramy
Publications and source records attributed to Dickerson, Jeramy.
Study of Avalanche Behavior in 3 kV GaN Vertical P-N Diode under UIS Stress for Edge-Termination Optimization.
Abstract not provided.
On-Wafer Investigation of Avalanche Robustness in 1.3 kV GaN-on-GaN P-N Diode Under Unclamped Inductive Switching Stress.
Abstract not provided.
Realization of Medium-Voltage Vertical GaN PiN Diodes (invited).
Abstract not provided.
Analysis of the dependence of critical electric field on semiconductor bandgap
Abstract Understanding of semiconductor breakdown under high electric fields is an important aspect of materials’ properties, particularly for the design of power devices. For decades, a power-law has been used to describe the dependence of material-specific critical electrical field ( $${\mathcal{E}}_{\text{crit}}$$ E crit ) at which the material breaks down and bandgap ( E g ) . The relationship is often used to gauge tradeoffs of emerging materials whose properties haven’t yet been determined. Unfortunately, the reported dependencies of $${\mathcal{E}}_{\text{crit}}$$ E crit on E g cover a surprisingly wide range in the literature. Moreover, $${\mathcal{E}}_{\text{crit}}$$ E crit is a function of material doping. Further, discrepancies arise in $${\mathcal{E}}_{\text{crit}}$$ E crit values owing to differences between punch-through and non-punch-through device structures. We report a new normalization procedure that enables comparison of critical electric field values across materials, doping, and different device types. An extensive examination of numerous references reveals that the dependence $${\mathcal{E}}_{\text{crit}}$$ E crit ∝ E g 1.83 best fits the most reliable and newest data for both direct and indirect semiconductors. Graphical abstract
Progress in Fabrication and Characterization of Vertical GaN Power Devices (invited).
Abstract not provided.
Development of Vertical GaN Power Devices for Use in Electric Vehicle Drivetrains (invited).
Abstract not provided.
Etched and Regrown Vertical GaN Junction Barrier Schottky Diodes.
Abstract not provided.
Vertical GaN PN Diodes for Grid Resiliency and Medium-Voltage Power Electronics.
Abstract not provided.
Etched and Regrown Vertical GaN Junction Barrier Schottky Diodes.
Abstract not provided.