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Diller, T. E.

Publications and source records attributed to Diller, T. E..

Heat flux instrumentation for HYFLITE thermal protection system

Tasks performed in this project were defined in a September 9, 1994 meeting of representatives of Vatell, NASA Lewis and Virginia Tech. The overall objective agreed upon in the meeting was 'to demonstrate the viability of thin film techniques for heat flux and temperature sensing in HYSTEP thermal protection systems'. We decided to attempt a combination of NASA's and Vatell's best heat flux sensor technology in a sensor which would be tested in the Vortek facility at Lewis early in 1995. The NASA concept for thermocouple measurement of surface temperature was adopted, and Vatell methods for fabrication of sensors on small diameter substrates of aluminum nitride were used to produce a sensor. This sensor was then encapsulated in a NARloy-Z housing. Various improvements to the Vatell substrate design were explored without success. The basic NASA and Vatell sensor layouts were analyzed by finite element modeling, in an attempt to better understand the effects of material properties, dimensions and thermal differential element location on sensor symmetry, bandwidth and sensitivity. This analysis showed that, as long as the thermal resistivity of the thermal differential element material is much larger (10X) than that of the substrate material, the simplest arrangement of layer is best. During calibration of the sensor produced in this project, undesirable side-effects of combining the heat flux and temperature sensor return leads were observed. The sensor did not cleanly separate the heat flux and temperature signals, as sensors with four leads have consistently done before. Task 7 and 8 discussed in the meeting will be performed with a continuation of funding in 1995. The following is a discussion of each of the tasks performed as outlined in the statement of work dated september 26, 1994. Task 1A was added to cover further investigation into the NASA sensor concept.

Diller, T. E.↗

Measurement of a surface heat flux and temperature

The Heat Flux Microsensor is a new sensor which was recently patented by Virginia Tech and is just starting to be marketed by Vatell Corp. The sensor is made using the thin-film microfabrication techniques directly on the material that is to be measured. It consists of several thin-film layers forming a differential thermopile across a thermal resistance layer. The measured heat flux q is proportional to the temperature difference across the resistance layer q= k(sub g)/delta(sub g) x (t(sub 1) - T(sub 2)), where k(sub g) is the thermal conductivity and delta (sub g) is the thickness of the thermal resistance layer. Because the gages are sputter coated directly onto the surface, their total thickness is less than 2 micrometers, which is two orders of magnitude thinner than previous gages. The resulting temperature difference across the thermal resistance layer (delta is less than 1 micrometer) is very small even at high heat fluxes. To generate a measurable signal many thermocouple pairs are put in series to form a differential thermopile. The combination of series thermocouple junctions and thin-film design creates a gage with very attractive characteristics. It is not only physically non-intrusive to the flow, but also causes minimal disruption of the surface temperature. Because it is so thin, the response time is less than 20 microsec. Consequently, the frequency response is flat from 0 to over 50 kHz. Moreover, the signal of the Heat Flux Microsensor is directly proportional to the heat flux. Therefore, it can easily be used in both steady and transient flows, and it measures both the steady and unsteady components of the surface heat flux. A version of the Heat Flux Microsensor has been developed to meet the harsh demands of combustion environments. These gages use platinum and platinum-10 percent rhodium as the thermoelectric materials. The thermal resistance layer is silicon monoxide and a protective coating of Al2O3 is deposited on top of the sensor. The superimposed thin-film pattern of all six layers is presented. The large pads are for connection with pins used to bring the signal out the back of the ceramic. In addition to the heat flux measurement, the surface temperature is measured with a platinum resistance layer (RTS). The resistance of this layer increases with increasing temperature. Therefore, these gages simultaneously measure the surface temperature and heat flux. The demonstrated applications include rocket nozzles, SCRAM jet engines, gas turbine engines, boiling heat transfer, flame experiments, basic fluid heat transfer, hypersonic flight, and shock tube testing. The laboratory involves using one of these sensors in a small combustion flame. The sensor is made on a 2.5 cm diameter piece of aluminum nitride ceramic.

Davis, R. M.↗

Heat flux instrumentation for Hyflite thermal protection system

Using Thermal Protection Tile core samples supplied by NASA, the surface characteristics of the FRCI, TUFI, and RCG coatings were evaluated. Based on these results, appropriate methods of surface preparation were determined and tested for the required sputtering processes. Sample sensors were fabricated on the RCG coating and adhesion was acceptable. Based on these encouraging results, complete Heat Flux Microsensors were fabricated on the RCG coating. The issue of lead attachment was addressed with the annnealing and welding methods developed at NASA Lewis. Parallel gap welding appears to be the best method of lead attachment with prior heat treatment of the sputtered pads. Sample Heat Flux Microsensors were submitted for testing in the NASA Ames arc jet facility. Details of the project are contained in two attached reports. One additional item of interest is contained in the attached AIAA paper, which gives details of the transient response of a Heat Flux Microsensors in a shock tube facility at Virginia Tech. The response of the heat flux sensor was measured to be faster than 10 micro-s.

Diller, T. E.↗

Heat flux microsensor measurements

A thin-film heat flux sensor has been fabricated on a stainless steel substrate. The thermocouple elements of the heat flux sensor were nickel and nichrome, and the temperature resistance sensor was platinum. The completed heat flux microsensor was calibrated at the AEDC radiation facility. The gage output was linear with heat flux with no apparent temperature effect on sensitivity. The gage was used for heat flux measurements at the NASA Langley Vitiated Air Test Facility. Vitiated air was expanded to Mach 3.0 and hydrogen fuel was injected. Measurements were made on the wall of a diverging duct downstream of the injector during all stages of the hydrogen combustion tests. Because the wall and the gage were not actively cooled, the wall temperature reached over 1000 C (1900 F) during the most severe test.

Terrell, J. P.↗