Engineering topics
Publications and source records attributed to Ehland, J..
Array of tiny probes tests complex printed circuit boards prior to mounting of microcircuit chips and other active and passive components. Insertion and alignment of board, performance of entire computer-controlled test, and printing of results requires about a minute; performed manually same tests require as much as 30 hours.
Packaging techniques for ultra high speed image processing were developed. These techniques involve the development of a signal feedthrough technique through LSI/VLSI sapphire substrates. This allows the stacking of LSI/VLSI circuit substrates in a 3 dimensional package with greatly reduced length of interconnecting lines between the LSI/VLSI circuits. The reduced parasitic capacitances results in higher LSI/VLSI computational speeds at significantly reduced power consumption levels.