Engineering topics

Ellis, Michael C.

Publications and source records attributed to Ellis, Michael C..

3 records

DOE OSTI2022

Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure

A heat transfer device includes a hollow spacer between opposed substrates, defining an enclosure, at least one of the substrates adapted to be secured to at least one heat source. A non-permeable barrier is in the enclosure between the substrates. A first chamber inside the enclosure is defined by the spacer, the substrates, and the barrier, the first chamber in fluid communication with at least one first inlet and first outlet. A second chamber inside the enclosure and outside the first chamber and is defined by the spacer, the substrates, and the barrier, the second chamber in fluid communication with at least one second outlet. A wick structure is secured to at least one substrate, a first portion of the wick structure in the first chamber, and a second portion of the wick structure in the second chamber and interconnecting in passive liquid communication with the first portion.

Shaeri, Mohammad Reza↗

DOE OSTI2021

Technoeconomic Benefits of Film-Forming Amine Products Applied to Steam Surface Condensers

In a conventional Rankine cycle, the majority of power plants employ surface condensers that use pumped cooling water to reject heat from the cycle. In such cases, heat rejection occurs in a shell and tube heat exchanger by film-wise condensation of low-pressure steam on stainless steel, titanium, brass, or copper-nickel tubing. To improve the thermal performance of steam surface condensers, a replenishable film-forming substance (FFS) can be ap-plied to the condenser tubing to promote efficient dropwise condensation. Conventionally, film-forming amine prod-uct (FFAP) coatings protect boiler surfaces from oxidative corrosion, which substantially reduces the operation and maintenance costs. To quantify the technical and economic benefits of FFAP coatings applied to condenser tubing due to the promotion of dropwise condensation, a thermal resistance network model was established. Using a rep-resentative steam surface condenser, the improvements in thermal performance (overall heat transfer coefficient) and process parameters (net plant efficiency, cooling water flowrate, and turbine backpressure) were determined due to the enhancement in the condensation heat transfer coefficient. Experimentally measured condensation heat transfer coefficients for common condenser materials were compared with the modeling results and were found to be within attainable bounds. Lastly, the trend in total heat exchanger cost reduction is generalized to understand the trade-off between reduced surface area for heat rejection and increase in coating application costs for a re-plenishable coating system.

20 FOSSIL-FUELED POWER PLANTS↗

DOE OSTI2020

Thin hybrid capillary two-phase cooling system

A novel hybrid two-phase cooling system was developed that integrated a mechanically pumped two-phase loop with a capillary-driven two-phase cooling device. The latter cooling mechanism was based on evaporation/boiling from wick structures made by sintering copper particles on the interior surfaces of a copper cold plate. The cold plate provided cooling to two surfaces and each of them included four heaters in series. The novelty of the developed technology was preventing flooding of the evaporator wicks by isolating the evaporation surface from the pumped liquid flow that fed them. This arrangement allowed for a high liquid feed flow rate much greater than would be allowed by a capillary pumped system while maintaining a low thermal resistance at the evaporation surface. Using this approach, the cooling system removed over 850 W with a low pumping power below 1.0 W while using R245fa as the working fluid. The equivalent heat fluxes exceeded 970 W/cm 2 over areas less than 0.12 cm 2 . The measured thermal resistance was as low as 0.09 K-cm 2 /W. The presented thermal management solution enables an increase in the power of high heat flux electronic devices beyond the state-of-the-art.

42 ENGINEERING↗