Engineering topics

Emerson, Burt R., Jr.

Publications and source records attributed to Emerson, Burt R., Jr..

3 records

NASA NTRS1994

Metal-Ion Additives Reduce Thermal Expansion Of Polyimides

Polyimides widely used as high-performance polymers because of their excellent thermal stability and toughness. However, their coefficients of thermal expansion (CTE's) greater than those of metals, ceramics, and glasses. Decreasing CTE's of polyimides increase usefulness for aerospace and electronics applications in which dimensional stability required. Additives containing metal ions reduce coefficients of thermal expansion of polyimides. Reductions range from 11 to over 100 percent.

Stoakley, Diane M.↗

NASA NTRS1994

Insoluble, Low-Dielectric-Constant Polyimides

In process, insoluble, low-dielectric-constant polyimides produced by combining dianhydride of bis{4-(3,4-dicarboxyphenoxy) phenyl}perfluoroisopropylidene (BFDA) with fluorinated aromatic diamine; each molecule contains at least one or more CF3 groups. These fully fluorinated polyimides have dielectric constants in range of 2.4 to 2.5 at 10 GHz. Suitable for use as composite matrix resins in advanced aerospace applications. Potential use in microelectronics industry, particularly as insulating resins in production of printed-circuit boards.

St. Clair, Anne K.↗

NASA NTRS1990

Additives Lower Dielectric Constants Of Polyimides

Dielectric constants as low as 2.43 make polyimides more attractive for electronic applications. Process makes aromatic condensation polyimide films and coatings with dielectric constants lowered by incorporation of diamic acid additives. Materials provide better electrical insulation without sacrificing temperature stability of polyimide binders. Applicable whenever high temperature, low absorption of moisture, and high electrical-insulation properties needed. Applications include semiconductors and printed-circuit boards for computer industry and possibly automotive industry.

Stoakely, Diane M.↗