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Eremeev, G. [Fermilab] (ORCID:0000000238211300)

Publications and source records attributed to Eremeev, G. [Fermilab] (ORCID:0000000238211300).

Mechanically Polishing Electroplated Nb3Sn for Higher Accelerating Gradients

As the demand for more efficient SRF technology continues to rise, so does the need to improve the performance of Nb3Sn, the most promising alternative to niobium. Leveraging recent breakthroughs in Nb3Sn research from Cornell University and Fermilab, namely the electrochemical synthesis-based growth of Nb3Sn and the centrifugal barrel polishing (CBP) technique to smoothen the final Nb3Sn film, our primary goal is to reduce surface roughness while preserving the film’s quality. We present promising RF results from an electroplated cavity that underwent mechanical polishing using the CBP technique, which showed an increase in the maximum accelerating gradient compared to the baseline test. However, contamination-induced Q-slope limited performance. Temperature mapping reveals quench location and heating response before, during and after quench.

Shpani, L. [Cornell U.]↗

United States Muon Collider Community White Paper for the European Strategy for Particle Physics Update

This document is being submitted to the 2024-2026 European Strategy for Particle Physics Update (ESPPU) process on behalf of the US Muon Collider community, with its preparation coordinated by the interim US Muon Collider Coordination Group. The US Muon Collider Community comprises a few hundred American scientists. The purpose of the document is to inform ESPPU about the US plans for Muon Collider research and development (R&D), explain how these efforts align with the broader international R&D initiatives, and present the US community vision for the future realization of this transformative project.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Transfer of EP and Doping Technology for PIP-II HB650 Cavities from Fermilab to Industry

Fermilab has optimized the surface processing conditions for PIP-II high beta 650 MHz cavities. This encompasses conditions for bulk electropolishing, heat treatment, nitrogen doping, post-doping final electropolishing, and post-processing surface rinsing. The technology has been effectively transitioned to industry. This paper highlights the efforts made to fine-tune the process and to smoothly share them with the partner labs and an associated vendor.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗