The Influence of Grain Boundary Type upon Damage Evolution at Grain Boundary Interfaces
In a prior work, it was found that grain boundary structure strongly influences damage evolution at grain boundaries in copper samples subjected to either shock compression or incipient spall. Here, several grain boundaries with different grain boundary structures, including a {Sigma}3 (10-1) boundary, are interrogated via conventional transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM) to investigate the effects of atomic-scale structural differences on grain boundary strength and mobility. Boundaries are studied both before and after shock compression at a peak shock stress of 10 GPa. Results of the TEM and HRTEM work are used in conjunction with MD modeling to propose a model for shock-induced damage evolution at grain boundary interfaces that is dependent upon coincidence.