Engineering topics

Euy-sik Eugene Shin

Publications and source records attributed to Euy-sik Eugene Shin.

3 records

NASA NTRS2021

Improved Potting of Litz Wires for High Power Density Electric Motor

Specific details including selections of process materials, tooling/fixture setups, and a step-by-step procedure for scaling-up demonstrations of the newly developed potting process, namely vacuum-assisted axial injection potting (VaAIP) have been fully developed for the stator winding of high power density electric motors for the future electrified aircrafts. Various essential pre-trial subtasks identified for the full-scale demonstrations were carried out. To date, optimization of cure condition and thermal stability of the coating epoxy and determination of optimum application conditions and thermal stability of the high temperature encapsulant wax were completed successfully and other subtasks were under way. The efforts to enhance thermal conductivity of the selected potting compound by adding conductive nano fillers such as boron nitride nanosheets (BNNS) have also been advanced. Initially, selection of the best mixing method and procedures was attempted via extensive and systematic experimental design.

Litz wire↗

NASA NTRSDate not supplied

Progresses in Developing Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage Applications

Development of the novel patented high voltage insulation system, namely micro-multilayer multifunctional electrical insulation (MMEI) was continued particularly for the future hybrid or all electric aircraft applications. Initially, the concept and feasibility of the MMEI system were successfully demonstrated with its exceptionally high dielectric breakdown voltage via optimizing the multilayer structures of the Kapton® PI films and binder layers such as PFA in terms of individual film thickness and layer configuration. Overall, MMEI structures outperformed most of the state-of-the-art (SOA) polymer insulation materials or structures. Since then, further optimizations and improvement of the system were pursued with specific emphasis on multifunctionalities such as moisture blocking, partial discharge (PD) resistance, durability, etc. Efforts have been also continued to identify the controlling mechanisms for the major improvement in dielectric strength of the MMEI structures via 3-dimensional dielectric failure mode analysis. At the same time, significant progress has been made in scaling up the MMEI structures and assessing their commercial applicability and manufacturability by developing full-scale prototypes of electrical components, such as power cable and bus bar. Overall progresses on the MMEI development to date will be presented in this paper.

Novel Electrical Insulation↗

NASA NTRSDate not supplied

Feasibility of Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage Applications

The newly patented micro-multilayer multifunctional electrical insulation (MMEI) system was developed for future electric aircraft applications which critically require lightweight but high voltage (HV), high temperature, and corona or partial discharge (PD) resistant insulation. During the initial development stages, the concept and practicability of the MMEI system were successfully validated with its exceptionally high dielectric breakdown voltages. The multilayer structures were optimized in terms of material type, individual layer thickness, and overall layer configuration along with potential mechanisms identified for its superior performance. Subsequently, scalability, manufacturability, and commercial applicability of the MMEI system were demonstrated with the 1 meter long, 3-phase HV, high power (HP) bus bar prototypes. Two prototypes, one with the conventional SOA insulation system including Mica sheet and the other with an optimized MMEI, were designed, fabricated, and tested successfully. Both prototypes passed both HiPot and PD tests up to the highest test voltage available, 15 kVAC, although the latter showed a slight increase in PD activities at 12.5 kV. However, the prototype with MMEI was 15% lighter or 12% thinner than the other one. Current efforts to significantly enhance the PD resistance of the MMEI system by employing semiconductive shielding layers, which can be also multifunctional, e.g., electromagnetic interference shielding, moisture blocking, heat dissipation, for various HV applications are also discussed in this paper.

Novel Electrical Insulation↗