Search NASASearch

Engineering topics

Fan, Mark S.

Publications and source records attributed to Fan, Mark S..

Dynamic Response Assessment for the MEMS Accelerometer Under Severe Shock Loads

NASA Goddard Space Flight Center (GSFC) has evaluated the dynamic response of a commercial-off-the-shelf (COTS) microelectromechanical systems (MEMS) device made by Analog Device, Inc. The device is designated as ADXL250 and is designed mainly for sensing dynamic acceleration. It is also used to measure the tilting angle of any system or component from its original level position. The device has been in commercial use (e.g., in automobile airbag deployment system as a dual-axial accelerometer and in the electronic game play-station as a tilting sensor) with success, but NASA needs an in-depth assessment of its performance under severe dynamic shock environments. It was realized while planning this evaluation task that two assessments would be beneficial to NASA's missions: (1) severe dynamic shock response under nominal thermal environments; and (2) general dynamic performance under cryogenic environments. The first evaluation aims at obtaining a good understanding of its micromachined structure within a framework of brittle fracture dynamics, while the second evaluation focuses on the structure integrity under cryogenic temperature conditions. The information we gathered from the manufacturer indicated that the environmental stresses under NASA's evaluation program have been far beyond what the device has experienced with commercial applications, for which the device was designed. Thus NASA needs the outcome of this evaluation in order to make the selection for possible use for its missions. This paper provides details of the first evaluation the dynamic response under severe multi-axial single-pulse shock load. It was performed using finite element tools with nonlinear dynamics procedures.

Fan, Mark S.

Thermal Characterization for a Modular 3-D Multichip Module

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Fan, Mark S.

Structural Design and Analysis of a Light-Weight Laminated Composite Heat Sink for Spaceflight PWBs

In order to reduce the overall weight in spaceborne electronic systems, a conventional metallic heat sink typically used for double-sided printed wiring boards was suggested to be replaced by light-weight and high-strength laminated composite materials. Through technology validation assurance (TVA) approach, it has been successfully demonstrated that using laminated composite heat sink can not only reduce the weight of the heat sink by nearly 50%, but also significantly lower the internal thermally-induced stresses that are largely responsible for potential delamination under cyclic temperature variations. With composite heat sink, both thermal and dynamic performance of the double-sided printed wiring board (PWB) exceeds that of its counterpart with metallic heat sink. Also included in this work is the original contribution to the understanding of creep behavior of the worst-case leadless chip carrier (LCC) surface mount solder joint. This was identified as the interconnection most susceptible to thermal fatigue damage in the PWB assembly.

Fan, Mark S.

Automated inspection of solder joints for surface mount technology

Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

Savage, Robert M.

Two-dimensional thermal modeling of power monolithic microwave integrated circuits (MMIC's)

Numerical simulations of the two-dimensional temperature distributions for a typical GaAs MMIC circuit are conducted, aiming at understanding the heat conduction process of the circuit chip and providing temperature information for device reliability analysis. The method used is to solve the two-dimensional heat conduction equation with a control-volume-based finite difference scheme. In particular, the effects of the power dissipation and the ambient temperature are examined, and the criterion for the worst operating environment is discussed in terms of the allowed highest device junction temperature.

Fan, Mark S.