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Feller, A.

Publications and source records attributed to Feller, A..

Development of CMOS integrated circuits

Report documents life cycles of two custom CMOS integrated circuits: (1) 4-bit multiplexed register with shift left and shift right capabilities, and (2) dual 4-bit registers. Cycles described include conception as logic diagrams through design, fabrication, testing, and delivery.

Bertino, F.

CMOS-array design-automation techniques

Thirty four page report discusses design of 4,096-bit complementary metal oxide semiconductor (CMOS) read-only memory (ROM). CMOSROM is either mask or laser programable. Report is divided into six sections; section one describes background of ROM chips; section two presents design goals for chip; section three discusses chip implementation and chip statistics; conclusions and recommendations are given in sections four thru six.

Feller, A.

C-MOS array design techniques

The entire complement of standard cells and components, except for the set-reset flip-flop, was completed. Two levels of checking were performed on each device. Logic cells and topological layout are described. All the related computer programs were coded and one level of debugging was completed. The logic for the test chip was modified and updated. This test chip served as the first test vehicle to exercise the standard cell complementary MOS(C-MOS) automatic artwork generation capability.

Feller, A.

Design, development, fabrication and delivery of register and multiplexer units

Several approaches for implementing the register and multiplexer unit into two CMOS monolithic chip types were evaluated. The CMOS standard cell array technique was selected and implemented. Using this design automation technology, two LSI CMOS arrays were designed, fabricated, packaged, and tested for proper static, functional, and dynamic operation. One of the chip types, multiplexer register type 1, is fabricated on a 0.143 x 0.123 inch chip. It uses nine standard cell types for a total of 54 standard cells. This involves more than 350 transistors and has the functional equivalent of 111 gates. The second chip, multiplexer register type 2, is housed on a 0.12 x 0.12 inch die. It uses 13 standard cell types, for a total of 42 standard cells. It contains more than 300 transistors, the functional equivalent of 112 gates. All of the hermetically sealed units were initially screened for proper functional operation. The static leakage and the dynamic leakage were measured. Dynamic measurements were made and recorded. At 10 V, 14 megabit shifting rates were measured on multiplexer register type 1. At 5 V these units shifted data at a 6.6 MHz rate. The units were designed to operate over the 3 to 15 V operating range and over a temperature range of -55 to 125 C.

Feller, A.

Expansion of CMOS array design techniques

The important features of the multiport (double entry) automatic placement and routing programs for standard cells are described. Measured performance and predicted performance were compared for seven CMOS/SOS array types and hybrids designed with the high speed CMOS/SOS cell family. The CMOS/SOS standard cell data sheets are listed and described.

Feller, A.

CMOS array design automation techniques

The design considerations and the circuit development for a 4096-bit CMOS SOS ROM chip, the ATL078 are described. Organization of the ATL078 is 512 words by 8 bits. The ROM was designed to be programmable either at the metal mask level or by a directed laser beam after processing. The development of a 4K CMOS SOS ROM fills a void left by available ROM chip types, and makes the design of a totally major high speed system more realizable.

Lombardi, T.

Economical custom LSI arrays

Automatic design technique uses standard circuit cells for producing large-scale integrated arrays. Computerized fabrication process provides individual cells of high density and efficiency, quick turnaround time, low cost, and ease of corrections for changes and errors.

Feller, A.

CMOS array design automation techniques

A low cost, quick turnaround technique for generating custom metal oxide semiconductor arrays using the standard cell approach was developed, implemented, tested and validated. Basic cell design topology and guidelines are defined based on an extensive analysis that includes circuit, layout, process, array topology and required performance considerations particularly high circuit speed.

Ramondetta, P.

Design automation techniques for custom LSI arrays

The standard cell design automation technique is described as an approach for generating random logic PMOS, CMOS or CMOS/SOS custom large scale integration arrays with low initial nonrecurring costs and quick turnaround time or design cycle. The system is composed of predesigned circuit functions or cells and computer programs capable of automatic placement and interconnection of the cells in accordance with an input data net list. The program generates a set of instructions to drive an automatic precision artwork generator. A series of support design automation and simulation programs are described, including programs for verifying correctness of the logic on the arrays, performing dc and dynamic analysis of MOS devices, and generating test sequences.

Feller, A.

SUMC-DV hardware manual

The assembly, the physical and electrical characteristics, and the basic electrical tests of the Space Ultrareliable Modular Computer Demonstration Vehicle (SUMC-DV), are described. The descriptions include: (1) the packaging concepts, physical assembly, design and fabrication using design automation techniques of 10 different types of custom CMOS LSI arrays; (2) the fabrication and testing of the various components including the LSI arrays; (3) the hierarchy of the memory complement and the clock generation and distribution system; (4) system testing techniques; and (5) the procedure employed in the electrical checkout of the system.

Feller, A.

LSI computer fabrication - SUMC/DV.

The SUMC/DV (Space Ultrareliable Modular Computer Demonstration Vehicle), which required the design and fabrication of ten different array types, was designed, partitioned, assembled, tested, and made completely operational in less than one year. This paper describes the assembly, the physical and electrical characteristics, and the basic electrical testing procedures used on SUMC/DV. The paper includes a description of the packaging concepts, the physical assembly, the fabrication and testing of the various components including the LSI/CMOS arrays, the hierarchy of the memory complement, the clock generation and distribution scheme, additional system testing techniques, and the procedure employed in the electrical checkout of the system.

Feller, A.

Design, development, fabrication and delivery of register and multiplexer units

Two complementary MOS monolithic chip types were developed, which contain a register and multiplexer unit to be used in the central processing unit of a digital computer. The partition of the logic into a chip size consistent with the characteristics of the packages is discussed. The logic was implemented by specially configured circuitry designed to layout, as well as to optimize, performance by taking advantage of the properties of CMOS logic. Of several approaches considered for generating LSI CMOS arrays, the CMOS standard cell array design technique was selected. These design automation techniques were used to generate the chip layout, art work and working master plates, followed by the fabrication and testing of the two chip types. Sixty functional LSI arrays were delivered.

Feller, A.