Fenske, Matthew T. | Search NASA

NASA NTRS1999

The Development of Lightweight Electronics Enclosures for Space Applications

This paper outlines the end to end effort to produce lightweight electronics enclosures for NASA GSFC electronics applications with the end goal of presenting an array of lightweight box options for a flight opportunity. Topics including the development of requirements, design of three different boxes, utilization of advanced materials and processes, and analysis and test will be discussed. Three different boxes were developed independently and in parallel. A lightweight machined Aluminum box, a cast Aluminum box and a composite box were designed, fabricated, and tested both mechanically and thermally. There were many challenges encountered in meeting the requirements with a non-metallic enclosure and the development of the composite box employed several innovative techniques.

Fenske, Matthew T.↗

NASA NTRS1999

The Development of Lightweight Electronics Enclosures for Space Applications

This paper outlines the end to end effort to produce lightweight electronics enclosures for NASA GSFC electronics applications with the end goal of presenting an array of lightweight box options for a flight opportunity. Topics including the development of requirements, design of three different boxes, utilization of advanced materials and processes, and analysis and test will be discussed. Three different boxes were developed independently and in parallel. A lightweight machined Aluminum box, a cast Aluminum box and a composite box were designed, fabricated, and tested both mechanically and thermally. There were many challenges encountered in meeting the requirements with a non-metallic enclosure and the development of the composite box employed several innovative techniques.

Fenske, Matthew T.↗

NASA NTRS1999

The Inclusion of In-Plane Stresses in Delamination Criteria

A study of delamination failure was conducted with emphasis on delamination criteria. Evidence is presented which supports the inclusion of the in-plane stresses in addition to the interlaminar stress terms in delamination criteria. The delamination is characterized as the failure of a resin rich region in between ply sets. The entire six component stress state in this resin layer is calculated through a finite element analysis, averaged over a dimension of 1.75 ply thicknesses, and used in a Modified von Mises Delamination Criterion. This criterion builds onto previous criteria by including all six stress components in the interply resin layer. The MVMDC shows good correlation to experimental data. The results show that the treatment of delamination as the failure of a finite interply resin layer is a valid method and that the MVMDC, considering the full stress state, accurately indicates delamination for different laminate families.

Fenske, Matthew T.↗

NASA NTRS1998

The Inclusion of In-Plane Stresses in Delamination Criteria

A study of delamination is performed including strength of materials and fracture mechanics approaches with emphasis placed on methods of delamination prediction. Evidence is presented which supports the inclusion of the in-plane stresses in addition to the inter-laminar stress terms in delamination criteria. The delamination can be modeled as a resin rich region in between ply sets. The entire six component stress state in this resin layer is calculated through a finite element analysis and inputted into a new Modified Von Mises Delamination Criterion. This criterion builds onto previous criteria by including all six stress components. The MVMDC shows improved correlation to experimental data.

Vizzini, Anthony J.↗