A new packaging and testing concept for microelectronic components
Parts are securely held on sealed, printed circuit board that is both package and test fixture. Parts can be handled, stored, and tested in sealed package.
Engineering topics
Publications and source records attributed to Filip, G. L..
Parts are securely held on sealed, printed circuit board that is both package and test fixture. Parts can be handled, stored, and tested in sealed package.
A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.
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Method for coating through-holes in ceramic substrates used in fabricating miniaturized electronic circuits
Marshall Space Flight Center thin film microcircuit development program
New thin film microdeposition unit for operating with various combinations of substrates, masks, and evaporation sources