Engineering topics
Finkbeiner, Fred
Publications and source records attributed to Finkbeiner, Fred.
The Impact of Transition Edge Sensor Design on Achievable Performance Uniformity of Kilo-Pixel Arrays
Future astronomy missions using x-ray transition-edge sensor (TES) microcalorimeters, such as X-IFU on Athena, will require large arrays of 1000s of pixels fabricated on a single wafer. To wire out so many pixels the current array designs have pixels with different rotational orientations. Fabrication is done in multiple layers and so, dependent on method, there is potential for spatial misalignment between layers. Because of the variation of orientation of pixels, misalignment may not impact each pixel equally. This has the potential to degrade the achievable uniformity of performance across an array. How well aligned do different layers need to be? How does sensitivity to misalignment depend on choice of pixel design?
Design of High Resolution Soft X-Ray Microcalorimeters Using Magnetic Penetration Thermometers
We have designed high-resolution soft x-ray microcalorimeters using magnetic penetration thermometers (MPTs) in an array of pixels covering a total of 2 square centimeters to have a resolving power of 300 at energies around 300 eV. This performance is desirable for studying the soft x-ray background from the warm hot intergalactic medium. MPT devices have small sensor heat capacity and high responsivities, which makes them excellent detector technology for attempting to attain sub-eV resolution. We are investigating the feasibility of pixels with absorbers that are 625 x 625 square micrometers, up to 1 x 1 square millimeters in area and 0.35 micrometer thick and thinner. Our tests have shown that suspended gold absorbers 0.35 micrometers thick (RRR = 6.7) are feasible to fabricate. We modeled the thermal diffusion from such thin gold over the size of a 625 x 625 square micrometer absorber, and conclude that the effect of the thermalization on the resolution of a 300 eV photon is an additional approximately 0.2 eV FWHM of broadening. We discuss the thermal effects of small absorber attachment sterns on solid substrate, as well as considerations for multiplexed readout. We will present the progress we have made towards building and testing this soft x-ray detector.
Absorber Materials for Transition-Edge Sensor X-ray Microcalorimeters
Arrays of superconducting transition-edge sensors (TES) can provide high spatial and energy resolution necessary for x-ray astronomy. High quantum efficiency and uniformity of response can be achieved with a suitable absorber material, in which absorber x-ray stopping power, heat capacity, and thermal conductivity are relevant parameters. Here we compare these parameters for bismuth and gold. We have fabricated electroplated gold, electroplated gold/electroplated bismuth, and evaporated gold/evaporated bismuth 8x8 absorber arrays and find that a correlation exists between the residual resistance ratio (RRR) and thin film microstructure. This finding indicates that we can tailor absorber material conductivity via microstructure alteration, so as to permit absorber thermalization on timescales suitable for high energy resolution x-ray microcalorimetry. We show that by incorporating absorbers possessing large grain size, including electroplated gold and electroplated gold/electroplated bismuth, into our current Mo/Au TES, devices with tunable heat capacity and energy resolution of 2.3 eV (gold) and 2.1 eV (gold/bismuth) FWHM at 6 keV have been fabricated.
Optimization of X-ray Absorbers for TES Microcalorimeters
We have investigated the thermal, electrical, and structural properties of Bi and BiCu films that are being developed as X-ray absorbers for transition-edge sensor (TES) microcalorimeter arrays for imaging X-ray spectroscopy. Bi could be an ideal material for an X-ray absorber due to its high X-ray stopping power and low heat capacity, but it has a low thermal conductivity, which can result in position dependence of the pulses in the absorber. In order to improve the thermal conductivity, we added Cu layers in between the Bi layers. We measured electrical and thermal conductivities of the films around 0.1 K(sub 1) the operating temperature of the TES calorimeter, to examine the films and to determine the optimal thickness of the Cu layer. From the electrical conductivity measurements, we found that the Cu is more resistive on the Bi than on a Si substrate. Together with an SEM picture of the Bi surface, we concluded that the rough surface of the Bi film makes the Cu layer resistive when the Cu layer is not thick enough t o fill in the roughness. From the thermal conductivity measurements, we determined the thermal diffusion constant to be 2 x l0(exp 3) micrometers squared per microsecond in a film that consists of 2.25 micrometers of Bi and 0.1 micrometers of Cu. We measured the position dependence in the film and found that its thermal diffusion constant is too low to get good energy resolution, because of the resistive Cu layer and/or possibly a very high heat capacity of our Bi films. We show plans to improve the thermal diffusion constant in our BiCu absorbers.