Update on the beam-induced heating and thermal analysis for the EIC vacuum chamber components
Explore the source record for details and available documents.
43 PARTICLE ACCELERATORS↗
Engineering topics
Gallagher, B.
Publications and source records attributed to Gallagher, B..
Resistive Wall Heating and Thermal Analysis of the EIC HSR Beam Screen
Explore the source record for details and available documents.
43 PARTICLE ACCELERATORS↗
Beam Induced Heating Analysis Update for the EIC Vacuum Chamber Components
One of the challenges of designing the Electron-Ion Col lider (EIC) is to mitigate beam-induced heating due to the intense electron and hadron beams. Heating of the ESR vac uum chamber components is mainly due to beam-induced resistive wall (RW) losses and synchrotron radiation. For the HSR heating is mainly due to large radial offsets and heat conduction from room temperature to cryogenic tem perature for cryo-components. In this paper, we provide an update on the beam-induced heating and thermal analysis of some critical ESR vacuum chamber components, such as the ESR Large Angle Bremhustraulung Monitor (LABM). We also provide a similar update for critical HSR vacuum com ponents, including the cryo-cooled BPM button assembly, beam screen, abort kicker, and polarimeter. To perform the thermal analyses, the resistive wall loss on individual compo nents is calculated with CST and the synchrotron radiation (if exists) is evaluated using SynRad. These losses, along with realistic boundary conditions are then fed to ANSYS to determine the temperature distribution.
43 PARTICLE ACCELERATORS↗
Flat-plate solar array project. Volume 5: Process development
The goal of the Process Development Area, as part of the Flat-Plate Solar Array (FSA) Project, was to develop and demonstrate solar cell fabrication and module assembly process technologies required to meet the cost, lifetime, production capacity, and performance goals of the FSA Project. R&D efforts expended by Government, Industry, and Universities in developing processes capable of meeting the projects goals during volume production conditions are summarized. The cost goals allocated for processing were demonstrated by small volume quantities that were extrapolated by cost analysis to large volume production. To provide proper focus and coverage of the process development effort, four separate technology sections are discussed: surface preparation, junction formation, metallization, and module assembly.
Gallagher, B.↗