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Gastineau, Lucas

Publications and source records attributed to Gastineau, Lucas.

Design of High-Power Polyphase PCB Coil Systems for Wireless Power Transfer

Printed circuit board (PCB) coils have been proposed prior for implementation as inductive wireless charging coils to minimize size and cost. Utilization of PCBs can allow for a reduced cost, improved manufacturability, and a wide range of geometric customization options. To circumvent material limitations on insulation and thermal performance, parallel paths can be implemented to divide the current per path accordingly. Within this paper, an unconventional high-power PCB coil is designed employing all possible techniques for wiring with axial and radial parallel paths with equivalent transposition to minimize circulating currents. Design studies are simulated in 3D finite element analysis (FEA) to evaluate imbalance between phases with and without transposition. Two experimental prototype coils were fabricated with measurements for self-inductance and mutual inductance between phases. These measurements were validated to be sufficiently consistent with FEA results. Additionally, a method is proposed for a two-step optimization of coupling coefficient and coil losses.

Lewis, Donovin D.↗

High-Power Polyphase PCB-Type Inductive Coupler for Wireless Electric Vehicle Charging

The cost and manufacturing difficulty of traditionally wound coils for wireless charging of electric vehicles has led to the exploration of alternative manufacturing for scalable deployment at a range of rated powers. A rotating-field polyphase wireless coupler is developed with balanced fully pitched coils which are not possible with conventional Litz wire. The usage of printed circuit board (PCB) technology is proposed for the innovative construction at large dimensions due to reduced cost, increased ease of manufacturability, and potential geometric customization compared to would coils. Design considerations specific to PCBs are detailed for wireless power transfer coils including advantages such as the potential for many turns and transposition with planar interconnections. A design procedure is developed which may be used to investigate the frequency to power to dimension correlation and limits associated with PCB coils. Designs are simulated in 3D electromagnetic finite element analysis (FEA) for the polyphase coil to evaluate the coupling between coils with varying geometric parameters at 100mm and 500mm outer diameters. A discussion is included on methods to increase PCB power ratings through a mixture of layer stacking, connections, and material selection.

Lewis, Donovin D.↗