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Gibbel, Mark

Publications and source records attributed to Gibbel, Mark.

8 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Failure Engineering Study and Accelerated Stress Test Results for the Mars Global Surveyor Spacecraft's Power Shunt Assemblies

An Engineering-of-Failure approach to designing and executing an accelerated product qualification test was performed to support a risk assessment of a "work-around" necessitated by an on-orbit failure of another piece of hardware on the Mars Global Surveyor spacecraft. The proposed work-around involved exceeding the previous qualification experience both in terms of extreme cold exposure level and in terms of demonstrated low cycle fatigue life for the power shunt assemblies. An analysis was performed to identify potential failure sites, modes and associated failure mechanisms consistent with the new use conditions. A test was then designed and executed which accelerated the failure mechanisms identified by analysis. Verification of the resulting failure mechanism concluded the effort.

Gibbel, Mark↗
NASA NTRS1999

Failure Engineering Study and Accelerated Stress Test Results for the Mars Global Surveyor Spacecraft's Power Shunt Assemblies

Due to a post launch failure of a part a new plan for the Mars Global Surveyor was developed. This new plan involved the addition of many deep thermal cycles to the Power Shunt Assemblies (PSA's). This new plan exceeds the previous acceptance cold level, and fatigue life on packaging design. This presentation reviews the experiments that were used to test the capabilities of the PSA to function in the new situation. It also reviews the analyses preformed to verify the most likely failure mechanism, and the likelihood that these failures would impact the new mission requirements.

Gibbel, Mark↗
NASA NTRS1997

Environmental Stress Screening 2000

The following identifies the authors of this report and the organizations that sponsored the effort conducted under the National Center for Manufacturing Sciences (NCMS) Environmental Stress Screening (ESS) 2000 Project.

Environment↗
NASA NTRS1996

Methodology for Physics and Engineering of Reliable Products

Physics of failure approaches have gained wide spread acceptance within the electronic reliability community. These methodologies involve identifying root cause failure mechanisms, developing associated models, and utilizing these models to inprove time to market, lower development and build costs and higher reliability. The methodology outlined herein sets forth a process, based on integration of both physics and engineering principles, for achieving the same goals.

failure analysis electronics reliability PACT (pre↗
NASA NTRS1996

NCMS ESS 2000 Project

ESS 2000 has the vision of enhancing the knowledge necessary to implement cost-effective, leading-edge ESS technologies and procedures in order to increase U.S. electronics industry competitiveness. This paper defines EES and discusses the factors driving the project, the objectives of the project, its participants, the three phases of the project, the technologies involved, and project deliverables.

ESS environmental stress screening electronics ind↗
NASA NTRS1990

Thermal/vacuum vs. thermal atmospheric testing of space flight electronic assemblies

For space flight hardware, the thermal vacuum environmental test is the best test of a system's flight worthiness. Substituting an atmospheric pressure thermal test for a thermal/vacuum test can effectively reduce piece part temperatures by 20 C or more, even for low power density designs. Similar reductions in test effectiveness can also result from improper assembly level T/V test boundary conditions. The net result of these changes may reduce the effective test temperatures to the point where there is zero or negative margin over the flight thermal environment.

Gibbel, Mark↗
NASA NTRS1990

Electronic assembly thermal testing - Dwell/duration/cycling

Testing of electronic assemblies varies throughout industry, NASA, and the military. Differences include test levels, atmospheric versus vacuum testing of assemblies, dwell durations at temperature extremes (especially high temperature), and thermal cycling versus dwell testing. Of particular interest are the different philosophies of thermal cycling versus single-cycle thermal dwell. An examination of the various failure physics for electronic assemblies has been initiated at JPL. The intent is to determine which failure modes are best revealed by thermal cycling testing and which are susceptible to high-temperature dwell physics. Preliminary results of this study are presented, along with discussions of testing goals, flight environments, reliability models, and the differences between industry and JPL design/test approaches.

Gibbel, Mark↗