Engineering topics
Publications and source records attributed to Goverdhanam, Kavita.
This paper presents an overview of microwave technologies for Small Satellites including NanoSats and CubeSats. In addition, examples of space communication technology demonstration projects using CubeSats are presented. Furthermore, examples of miniature instruments for Earth science measurements are discussed.
This paper presents an overview of microwave technologies for Small Satellites including NanoSats and CubeSats. In addition, examples of space communication technology demonstration projects using CubeSats are presented. Furthermore, examples of miniature instruments for Earth science measurements are discussed.
This paper presents an overview of microwave technologies for Small Satellites including NanoSats and CubeSats. In addition, examples of space communication technology demonstration projects using CubeSats are presented. Furthermore, examples of miniature instruments for Earth science measurements are discussed.
In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).
In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semiconductor devices and microelectromechanical systems (MEMS).
In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,
In this paper a new transmission line for microwave applications, referred to here as the Micro-Coplanar Stripline (MCPS), is introduced. The propagation characteristics, such as, characteristic impedance (Z(sub 0) and effective dielectric constant (epsilon eff) for a range of MCPS geometries have been modeled using the Finite Difference Time Domain (FDTD) Technique and presented here. Also, preliminary experimental results on the performance of an MCP-Microstrip transition and an MCPS-fed patch antenna are presented. The results indicate several potential applications of the MCPS line in microwave integrated circuit technology.
In this paper, coplanar stripline discontinuities such as a slit, a right angle bend and a T-junction are characterized and their performance is parameterized with respect to frequency and geometry. Lumped equivalent circuits are presented for some of them. The element values are obtained from the measured discontinuity scattering (S) parameters. The experimental results are compared with theoretical data obtained using the Finite Difference Time Domain (FD-TD) technique for validation and show very good agreement.