Engineering topics
Publications and source records attributed to Gurpreet Klar.
NASA invests in additive manufacturing (AM) to enable new mission architectures and design methods, including autonomous fabrication. AM is suited for backshell thermal protection materials that require many complex closeouts that lead to integration challenges. Current work will review printable backshell thermal protection material formulation, development, and characterization, such as Arc-jet testing results.
Leveraging AM technology focused on the Fused Deposition Modeling (FDM) process could automate the heat shield manufacturing process and allow it to reduce cost and build time and improve the design to 3D print and process TPS materials directly on the structure in monolith segments. Furthermore, AM allows the production of complicated three-dimensional geometry and density gradient layers without custom molds or special tools. NASA invests in additive manufacturing (AM) to enable new mission architectures and design methods; AM is suited for backshell thermal protection materials that require many complex closeouts that lead to integration challenges. Current work will review backshell thermal protection material formulation, development, and characterization.3D printer was used to 3D print arc-jet test coupons. The coupons were tested at the NASA Ames arc jet facility, and the results show promising properties compared with the heritage materials.
Phenolic resins are an important component of many ablative heat shield materials, which protect spacecrafts from the extreme temperatures reached during atmospheric entry. Examples include the high-density Heritage Carbon Phenolic (HCP) used in the Pioneer-Venus and Galileo missions, as well as the low-density Phenolic Impregnated Carbon Ablator (PICA) used in the Mars Science Laboratory and Mars 2020 missions. Additionally, recent developments within NASA have produced the mid-density Heatshield for Extreme Entry Environment Technology (HEEET) and its derivative 3D Woven Mid-Density Carbon Phenolic (3MDCP). Unlike the nonporous phenolic in HCP, PICA and HEEET/3MDCP are fabricated by infusing preforms with diluted phenolic formulations to obtain a lower density porous matrix. Despite the importance of the phenolic phase to the material response during entry, the variation in properties of porous and nonporous phenolic is not well understood. Here, we present an investigation of porous and nonporous phenolic resins using molecular dynamics (MD) simulations. Resin cure is mimicked in the simulations through the inclusion of representative reaction templates to generate accurate models of the complex crosslinked structures. To create porous models, explicit solvent molecules are included during the cure simulations. We observe nanoscale separation of the phenolic and solvent phases, which results in significant differences in the final structures of porous and nonporous models. In addition to a quantitative assessment of the network structure and porosity, we elucidate the effects of the phenolic formulation on the final material properties. These results are compared with experimental data as appropriate.