Engineering topics
Publications and source records attributed to Gustafson, G..
Optical interconnects are being considered for control signal distribution in phased array antennas. A packaged hybrid GaAs optical controller with a 1:16 demultiplexed output that is suitable for this application is described. The controller, which was fabricated using enhancement/depletion mode MESFET technology, operates at demultiplexer-limited input data rates up to 305 Mb/s and requires less than 200 microW optical input power.
GaAs circuits for use in a fully monolithic 1 Gb/s optical controller have been developed and tested. The circuits include photodetectors, transimpedance amplifiers and 1:16 demultiplexers that can directly control the phase of MMIC phase shifters. The entire chip contains approximately 300 self-aligned gate E/D-mode MESFETs. The MESFETs have one micron-wide gate and the E-mode FETs typically have transconductance of 200 ms/mm. Results of simulations and tests are reported. Also, the design and layout of the fully monolithic chip is discussed.
The breadboard feasibility model of a silicon piezoresistive pressure transducer suitable for space shuttle main engine (SSME) applications was demonstrated. The development of pressure instrumentation for the SSME was examined. The objective is to develop prototype pressure transducers which are targeted to meet the SSME performance design goals and to fabricate, test and deliver a total of 10 prototype units. Effective utilization of the many advantages of silicon piezoresistive strain sensing technology to achieve the objectives of advanced state-of-the-art pressure sensors for reliability, accuracy and ease of manufacture is analyzed. Integration of multiple functions on a single chip is the key attribute of the technology.
The development of prototype pressure transducers which are targeted to meet the Space Shuttle Main Engine SSME performance design goals is discussed. The fabrication, testing and delivery of 10 prototype units is examined. Silicon piezoresistive strain sensing technology is used to achieve the objectives of advanced state-of-the-art pressure sensors in terms of reliability, accuracy and ease of manufacture. Integration of multiple functions on a single chip is the key attribute of this technology.
The purpose of Modification No. 5 of this contract is to expand the scope of work (Task C) of this research study effort to develop pressure instrumentation for the SSME. The objective of this contract (Task C) is to direct Honeywell's Solid State Electronics Division's (SSED) extensive experience and expertise in solid state sensor technology to develop prototype pressure transducers which are targeted to meet the SSME performance design goals and to fabricate, test and deliver a total of 10 prototype units. SSED's basic approach is to effectively utilize the many advantages of silicon piezoresistive strain sensing technology to achieve the objectives of advanced state-of-the-art pressure sensors in terms of reliability, accuracy and ease of manufacture. More specifically, integration of multiple functions on a single chip is the key attribute of this technology which will be exploited during this research study.
The objective of the research project described is to define and demonstrate methods to advance the state of the art of pressure sensors for the space shuttle main engine (SSME). Silicon piezoresistive technology was utilized in completing tasks: generation and testing of three transducer design concepts for solid state applications; silicon resistor characterization at cryogenic temperatures; experimental chip mounting characterization; frequency response optimization and prototype design and fabrication. Excellent silicon sensor performance was demonstrated at liquid nitrogen temperature. A silicon resistor ion implant dose was customized for SSME temperature requirements. A basic acoustic modeling software program was developed as a design tool to evaluate frequency response characteristics.
Research concerning the development of pressure instrumentation for the space shuttle main engine is reported. The following specific topics were addressed: (1) transducer design and materials, (2) silicon piezoresistor characterization at cryogenic temperatures, (3) chip mounting characterization, and (4) frequency response optimization.
The advantages of silicon piezoresistive strain sensing technology are being used to achieve the objectives of state of the art pressure sensors for SSME applications. The integration of multiple functions on a single chip is the key attribute being exploited. Progress is reported in transducer packaging and materials; silicon resistor characterization at cryogenic temperatures; chip mounting; and frequency response optimization.